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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Current Rating | Package / Case | Lead Free | Factory Lead Time | Number of Pins | Lead Pitch | Pbfree Code | Number of Positions | Gender | Number of Contacts | Contact Finish - Mating | Orientation | Flammability Rating | ECCN Code | Additional Feature | Contact Material | Contact Plating | Housing Material | Radiation Hardening | Lead Length | HTS Code | Insulation Resistance | Contact Resistance | JESD-609 Code | Feature | Terminal Pitch | Operating Temperature (Max) | Pitch | Body Length or Diameter | Body Breadth | Number of Rows | Device Socket Type | Current Rating (Amps) | Contact Finish Termination | PCB Contact Pattern | Body Depth | Contact Style | Mating Contact Pitch | PCB Contact Row Spacing | Dielectric Withstanding Voltage | Number of Positions or Pins (Grid) | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 510-87-279-19-081101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 510 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-5108701205001101-datasheets-9040.pdf | 1A | 10 Weeks | 279 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 10mOhm | Open Frame | 279 (19 x 19) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | |||||||||||||||||||||||||||||||||||||
| 12-6810-90WR | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | Vertisockets™ 800 | Through Hole, Vertical | Through Hole, Right Angle, Vertical | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-0881090-datasheets-4388.pdf | 1.5A | 7 Weeks | yes | 12 | 12 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6 | 3.683mm | e4 | Closed Frame | 2.54mm | 0.65 inch | 0.69 inch | RECTANGULAR | 0.84 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 12 (2 x 6) | UL94 V-0 | 10.0μin 0.25μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.145 3.68mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||
| 14-820-90WR | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | Vertisockets™ 800 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-0882390-datasheets-3547.pdf | 1.5A | 7 Weeks | 14 | 14 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6 | 3.683mm | e4 | Closed Frame | 2.54mm | 0.75 inch | 0.4 inch | RECTANGULAR | 0.36 inch | SQ PIN-SKT | 0.1 inch | 0.1 mm | 14 (2 x 7) | UL94 V-0 | 10.0μin 0.25μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.145 3.68mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||
| 20-4518-10E | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.4 (10.16mm) Row Spacing | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-08351810t-datasheets-2464.pdf | 3A | 4 Weeks | 2.54mm | yes | 20 | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e3 | Open Frame | 105°C | 0.5 inch | 2 | RECTANGULAR | 0.173 inch | RND PIN-SKT | 0.1 inch | 0.4 mm | 20 (2 x 10) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||
| 05-0511-11 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 511 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | 125°C | -55°C | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-12051110-datasheets-7232.pdf | 1A | SIP | 7 Weeks | 2.54mm | 5 | Gold | UL94 V-0 | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.81mm | 2.54mm | 1 | 1A | 5 (1 x 5) | UL94 V-0 | 10.0μin 0.25μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.150 3.81mm | 0.100 2.54mm | Gold | 10.0μin 0.25μm | ||||||||||||||||||||||||||||||
| 299-83-640-10-002101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 299 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-2998731010001101-datasheets-3401.pdf | 1A | 10 Weeks | yes | 40 | Gold | Right Angle | UL94 V-0 | EAR99 | 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | No | 3.2512mm | 10000000000Ohm | 10mOhm | e3 | Closed Frame | 2 | RECTANGULAR | RND PIN-SKT | 0.1 inch | 40 (2 x 20) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.128 3.24mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||
| 16-8300-610C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 16 (2 x 8) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||
| 20-3508-20 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 508 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-06350830-datasheets-4085.pdf | 3A | 4 Weeks | 2.54mm | 20 | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 9.144mm | Open Frame | 0.4 inch | 2 | RECTANGULAR | 0.193 inch | RND PIN-SKT | 0.1 inch | 0.3 mm | 20 (2 x 10) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.360 9.14mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||
| 12-6810-90TWR | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | Vertisockets™ 800 | Through Hole, Vertical | Through Hole, Right Angle, Vertical | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | /files/arieselectronics-0881090-datasheets-4388.pdf | 1.5A | Lead Free | 7 Weeks | yes | 12 | 12 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6 | 3.683mm | e3 | Closed Frame | 2.54mm | 105°C | 0.65 inch | 0.69 inch | RECTANGULAR | 0.84 inch | SQ PIN-SKT | 0.1 inch | 0.6 mm | 12 (2 x 6) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.145 3.68mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||||||||
| 299-83-636-10-002101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 299 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-2998731010001101-datasheets-3401.pdf | 1A | 10 Weeks | 36 | yes | 36 | Gold | UL94 V-0 | EAR99 | 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.2512mm | 10000000000Ohm | 10mOhm | e3 | Closed Frame | 2.54mm | 1.8 inch | RECTANGULAR | RND PIN-SKT | 0.1 inch | 1400VAC V | 36 (2 x 18) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.128 3.24mm | 0.100 2.54mm | Tin | |||||||||||||||||||||||||
| 20-4508-30 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.4 (10.16mm) Row Spacing | 508 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-06350830-datasheets-4085.pdf | 3A | 4 Weeks | 2.54mm | 20 | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 12.7mm | Open Frame | 0.5 inch | 2 | RECTANGULAR | 0.193 inch | RND PIN-SKT | 0.1 inch | 0.4 mm | 20 (2 x 10) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.500 12.70mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||
| 16-81250-610C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 16 (2 x 8) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||
| 20-810-90TWR | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | Vertisockets™ 800 | Through Hole, Vertical | Through Hole, Right Angle, Vertical | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-0881090-datasheets-4388.pdf | 1.5A | 7 Weeks | yes | 20 | 20 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6 | 3.683mm | e3 | Closed Frame | 2.54mm | 105°C | 1.05 inch | 0.39 inch | RECTANGULAR | 1.24 inch | SQ PIN-SKT | 0.1 inch | 0.3 mm | 20 (2 x 10) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.145 3.68mm | 0.100 2.54mm | 200.0μin 5.08μm | |||||||||||||||||||||||||
| 17-0501-30 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 501 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | 105°C | -55°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-02050130-datasheets-3742.pdf | 1A | SIP | 7 Weeks | 2.54mm | 17 | Tin | UL94 V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 17.526mm | 2.54mm | 1 | 1A | 17 (1 x 17) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.690 17.52mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||
| APA-320-G-B | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | Not Applicable | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/samtec-apa320gb-datasheets-9143.pdf | 3 Weeks | yes | Male | 20 | Straight | EAR99 | BRASS | No | 8536.69.40.40 | e4 | 2.54mm | 2 | IC SOCKET | Gold (Au) - with Nickel (Ni) barrier | |||||||||||||||||||||||||||||||||||||||||||||||
| 18-6820-90C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | Vertisockets™ 800 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-1282390c-datasheets-6745.pdf | 3A | 6 Weeks | 18 | 18 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e4 | Closed Frame | 0.9 inch | 0.7 inch | 2 | RECTANGULAR | 0.565 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 18 (2 x 9) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||
| 16-8350-610C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | /files/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 16 (2 x 8) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||
| 18-6823-90C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | Vertisockets™ 800 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-1282390c-datasheets-6745.pdf | 3A | Lead Free | 6 Weeks | 18 | 18 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | Closed Frame | 2.54mm | 0.9 inch | 0.7 inch | RECTANGULAR | 0.528 inch | RND PIN-SKT | 0.1 inch | 0.3 mm | 18 (2 x 9) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||
| 20-822-90C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | Vertisockets™ 800 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1282390c-datasheets-6745.pdf | 3A | 6 Weeks | 20 | 2.54mm | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e4 | Closed Frame | 1 inch | 0.4 inch | 2 | RECTANGULAR | RND PIN-SKT | 0.1 inch | 20 (2 x 10) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||
| 14-1508-21 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.2 (5.08mm) Row Spacing | 508 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-01050830-datasheets-9229.pdf | 3A | 5 Weeks | 14 | 2.54mm | 14 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6 | 9.144mm | e4 | Closed Frame | 0.7 inch | 2 | RECTANGULAR | 0.193 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 14 (2 x 7) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.360 9.14mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||
| 16-8400-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 16 (2 x 8) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||
| 24-6518-01 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 518 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-08351800-datasheets-2355.pdf | 3A | 5 Weeks | 2.54mm | 24 | 24 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e4 | Open Frame | 2 | 24 (2 x 12) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||
| 16-8700-610C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 16 (2 x 8) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||
| 16-8500-610C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 16 (2 x 8) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||
| 22-0503-30 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 0503 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2003 | https://pdf.utmel.com/r/datasheets/arieselectronics-25050330-datasheets-3568.pdf | 3A | 5 Weeks | 2.54mm | 22 | 22 | Gold | UL94 HB | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA), Nylon, Glass Filled | 12.7mm | e0 | 1 | 22 (1 x 22) | UL94 HB | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.500 12.70mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||
| 510-87-273-21-121101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 510 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-5108701205001101-datasheets-9040.pdf | 1A | 10 Weeks | 273 | 273 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 8536.69.40.40 | 10mOhm | e3 | Open Frame | 273 (21 x 21) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | ||||||||||||||||||||||||||||||||
| 16-81100-310C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 16 | 16 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 16 (2 x 8) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||
| 20-4508-20 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.4 (10.16mm) Row Spacing | 508 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-06350830-datasheets-4085.pdf | 3A | 4 Weeks | 2.54mm | 20 | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 9.144mm | Open Frame | 0.5 inch | 2 | RECTANGULAR | 0.193 inch | RND PIN-SKT | 0.1 inch | 0.4 mm | 20 (2 x 10) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.360 9.14mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||
| 14-1508-31 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.2 (5.08mm) Row Spacing | 508 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-01050830-datasheets-9229.pdf | 3A | 5 Weeks | 14 | 2.54mm | 14 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6 | 12.7mm | e4 | Closed Frame | 0.7 inch | 2 | RECTANGULAR | 0.193 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 14 (2 x 7) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.500 12.70mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||
| APA-648-T-B | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | Not Applicable | ROHS3 Compliant | 3 Weeks | yes | Male | 48 | TIN OVER NICKEL (50) | Straight | EAR99 | BRASS | No | 8536.69.40.40 | e3 | 2.54mm | 2 | IC SOCKET | Tin (Sn) - with Nickel (Ni) barrier |
