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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | Max Operating Temperature | Min Operating Temperature | RoHS Status | Published | Datasheet | Current Rating | Package / Case | Length | Lead Free | Depth | Factory Lead Time | Number of Pins | Lead Pitch | Pbfree Code | Number of Positions | Gender | Number of Contacts | Contact Finish - Mating | Orientation | Flammability Rating | ECCN Code | Additional Feature | Contact Material | Contact Plating | Housing Material | Radiation Hardening | Lead Length | HTS Code | Max Current Rating | Insulation Resistance | Contact Resistance | JESD-609 Code | Feature | Terminal Pitch | Pitch | Insulation Material | Body Length or Diameter | Body Breadth | Number of Rows | Row Spacing | Device Socket Type | Current Rating (Amps) | Contact Finish Termination | PCB Contact Pattern | Body Depth | Contact Style | Mating Contact Pitch | PCB Contact Row Spacing | Dielectric Withstanding Voltage | Number of Positions or Pins (Grid) | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 25-0503-20 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 0503 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2003 | /files/arieselectronics-25050330-datasheets-3568.pdf | 3A | 5 Weeks | 2.54mm | 25 | 25 | Gold | UL94 HB | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA), Nylon, Glass Filled | 9.144mm | 2.5 inch | 1 | RECTANGULAR | RND PIN-SKT | 25 (1 x 25) | UL94 HB | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.360 9.14mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||||
| 510-83-174-17-061101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 510 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-5108701205001101-datasheets-9040.pdf | 1A | 10 Weeks | 174 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 10mOhm | Open Frame | 174 (17 x 17) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | |||||||||||||||||||||||||||||||||||||||||
| 110-43-304-61-105000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ROHS3 Compliant | 3 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 9-1437508-8 | TE Connectivity AMP Connectors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Transistor, TO-5 | 8059 | Socket | Through Hole | Bulk | 1 (Unlimited) | Solder | RoHS Compliant | 2014 | 19 Weeks | Gold | Closed Frame | 8 (Round) | Gold | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 614-87-100-13-062112 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 614 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-6148706810061112-datasheets-6299.pdf | 1A | 10 Weeks | 100 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.4544mm | 10mOhm | Carrier, Open Frame | 100 (13 x 13) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.136 3.45mm | 0.100 2.54mm | Tin | |||||||||||||||||||||||||||||||||||||||||
| 510-87-289-17-000101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 510 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-5108701205001101-datasheets-9040.pdf | 1A | 10 Weeks | 289 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 10mOhm | Closed Frame | 289 (17 x 17) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | |||||||||||||||||||||||||||||||||||||||||
| 714-43-248-31-018000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.1 (2.54mm) Row Spacing | 714 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 3A | 48 | yes | 48 | Gold | EAR99 | DIP SOCKET | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 4.318mm | 8536.90.40.00 | e3 | Carrier, Closed Frame | 48 (2 x 24) | 30.0μin 0.76μm | Beryllium Copper | Brass Alloy | 0.100 2.54mm | 0.170 4.32mm | 0.100 2.54mm | 30.0μin 0.76μm | |||||||||||||||||||||||||||||||||||||||||
| 20-81250-610C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | 8 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf | 3A | 6 Weeks | yes | 20 | 20 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e3 | Closed Frame, Elevated | 20 (2 x 10) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||||||
| APA-422-G-P | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | Not Applicable | ROHS3 Compliant | 3 Weeks | yes | Male | 22 | Straight | EAR99 | STANDARD: UL 94V-0 | BRASS/PHOSPHOR BRONZE | POLYESTER | No | 8536.69.40.40 | e4 | 2.54mm | 2 | IC SOCKET | Gold (Au) - with Nickel (Ni) barrier | ||||||||||||||||||||||||||||||||||||||||||||||||||
| 16-C195-30 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | EJECT-A-DIP™ | Surface Mount | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-14c28031-datasheets-8969.pdf | 3A | 5 Weeks | 2.54mm | yes | 16 | Gold | UL94 V-0 | EAR99 | LATCHED, UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 1.016mm | 1000000000Ohm | e3 | Closed Frame | 1.05 inch | 0.4 inch | 2 | RECTANGULAR | RND PIN-SKT | 0.1 inch | 0.3 mm | 1000VAC V | 16 (2 x 8) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.040 1.02mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||
| 16-7500-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 700 Elevator Strip-Line™ | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/arieselectronics-20782510-datasheets-7957.pdf | 1.5A | SIP | 7 Weeks | 2.54mm | 16 | Tin | UL94 V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.81mm | Elevated | 2.54mm | 2 | 1.5A | 16 (1 x 16) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.150 3.81mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||
| 714-43-148-31-018000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 714 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 3A | 48 | yes | 48 | Gold | EAR99 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 4.318mm | 8536.90.40.00 | e3 | Carrier | 48 (1 x 48) | 30.0μin 0.76μm | Beryllium Copper | Brass Alloy | 0.100 2.54mm | 0.170 4.32mm | 0.100 2.54mm | 30.0μin 0.76μm | ||||||||||||||||||||||||||||||||||||||||||
| 111-93-304-61-001000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Non-RoHS Compliant | 3 Weeks | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 8080-1G31 | TE Connectivity AMP Connectors |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Transistor, TO-3 | 8060 | Chassis Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | Non-RoHS Compliant | 2011 | /files/teconnectivityampconnectors-80801g24-datasheets-2580.pdf | 11 Weeks | Tin | Polytetrafluoroethylene (PTFE) | Closed Frame | 3 (Oval) | Beryllium Copper | Beryllium Copper | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| APA-640-G-A1 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | Not Applicable | 125°C | -55°C | ROHS3 Compliant | 2010 | 1A | 50.8mm | 17.65mm | 3 Weeks | yes | Male | 40 | Straight | EAR99 | STANDARD: UL 94V-0 | Brass | Gold | No | 1A | 5GOhm | e4 | 2.54mm | Polyester | 2 | 15.24 mm | IC SOCKET | ||||||||||||||||||||||||||||||||||||||||||
| 30-820-90C | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | Vertisockets™ 800 | Horizontal, Through Hole | Through Hole, Right Angle, Horizontal | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-1282390c-datasheets-6745.pdf | 3A | 6 Weeks | 30 | 30 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.556mm | e4 | Closed Frame | 2.54mm | 1.5 inch | 0.4 inch | RECTANGULAR | 0.565 inch | RND PIN-SKT | 0.1 inch | 0.1 mm | 30 (2 x 15) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.140 3.56mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||
| 24-3508-202 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.3 (7.62mm) Row Spacing | 508 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-143508301-datasheets-6498.pdf | 3A | 5 Weeks | 2.54mm | 24 | 24 | Gold | UL94 V-0 | EAR99 | STACKABLE | Polyamide (PA46), Nylon 4/6, Glass Filled | 9.144mm | Open Frame | 0.7 inch | 2 | RECTANGULAR | 0.19 inch | RND PIN-SKT | 0.1 inch | 0.3 mm | 24 (2 x 12) | UL94 V-0 | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.360 9.14mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||
| 16-7415-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 700 Elevator Strip-Line™ | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-20782510-datasheets-7957.pdf | 1.5A | SIP | 7 Weeks | 2.54mm | 16 | Tin | UL94 V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.81mm | Elevated | 2.54mm | 2 | 1.5A | 16 (1 x 16) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.150 3.81mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||
| 24-C182-00 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.6 (15.24mm) Row Spacing | EJECT-A-DIP™ | Surface Mount | Surface Mount | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-14c19500-datasheets-6379.pdf | 3A | 6 Weeks | 24 | 24 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 1.016mm | e4 | Closed Frame | 2 | 24 (2 x 12) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.040 1.02mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||
| APA-322-G-B | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | Not Applicable | ROHS3 Compliant | 3 Weeks | yes | Male | 22 | Straight | EAR99 | BRASS | No | 8536.69.40.40 | e4 | 2.54mm | 2 | IC SOCKET | Gold (Au) - with Nickel (Ni) barrier | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| 510-87-309-21-001101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 510 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-5108701205001101-datasheets-9040.pdf | 1A | 10 Weeks | 309 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 3.175mm | 10mOhm | Open Frame | 309 (21 x 21) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | Tin | |||||||||||||||||||||||||||||||||||||||||
| 16-71000-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 700 Elevator Strip-Line™ | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | 105°C | -55°C | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-20782510-datasheets-7957.pdf | 1.5A | SIP | 7 Weeks | 2.54mm | 16 | Tin | UL94 V-0 | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.81mm | Elevated | 2.54mm | 2 | 1.5A | 16 (1 x 16) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.150 3.81mm | 0.100 2.54mm | Tin | 200.0μin 5.08μm | |||||||||||||||||||||||||||||||||
| 33-0508-30 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 508 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-01050830-datasheets-9229.pdf | 3A | 5 Weeks | 33 | 2.54mm | 33 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6 | 12.7mm | e3 | 3.3 inch | 1 | RECTANGULAR | RND PIN-SKT | 33 (1 x 33) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.500 12.70mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||||
| 28-6553-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf | 1A | Lead Free | 4 Weeks | 28 | yes | 28 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | e3 | Closed Frame | 28 (2 x 14) | UL94 V-0 | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | |||||||||||||||||||||||||||||||||||||||
| APA-322-G-P | Samtec |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | Not Applicable | ROHS3 Compliant | /files/samtec-apa322gp-datasheets-0424.pdf | 3 Weeks | yes | Male | 22 | Straight | EAR99 | STANDARD: UL 94V-0 | BRASS/PHOSPHOR BRONZE | POLYESTER | No | 8536.69.40.40 | e4 | 2.54mm | 2 | IC SOCKET | Gold (Au) - with Nickel (Ni) barrier | |||||||||||||||||||||||||||||||||||||||||||||||||
| 714-43-149-31-018000 | Mill-Max Manufacturing Corp. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 714 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 3A | 49 | yes | 49 | Gold | EAR99 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 4.318mm | 8536.90.40.00 | e3 | Carrier | 49 (1 x 49) | 30.0μin 0.76μm | Beryllium Copper | Brass Alloy | 0.100 2.54mm | 0.170 4.32mm | 0.100 2.54mm | 30.0μin 0.76μm | ||||||||||||||||||||||||||||||||||||||||||
| 28-6551-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 55 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf | 1A | 4 Weeks | 28 | yes | 28 | Tin | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | e3 | Closed Frame | 28 (2 x 14) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||||||||||||||||||||||
| 16-0503-21 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 0503 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Wire Wrap | ROHS3 Compliant | 2003 | /files/arieselectronics-25050330-datasheets-3568.pdf | 3A | 5 Weeks | 2.54mm | 16 | 16 | Gold | UL94 HB | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA), Nylon, Glass Filled | 9.144mm | 1 | RECTANGULAR | RND PIN-SKT | 16 (1 x 16) | UL94 HB | 30.0μin 0.76μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.360 9.14mm | 0.100 2.54mm | 10.0μin 0.25μm | |||||||||||||||||||||||||||||||||||||
| 40-9513-11 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, 0.9 (22.86mm) Row Spacing | Lo-PRO®file, 513 | Through Hole | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-08251310-datasheets-2619.pdf | 3A | 5 Weeks | 2.54mm | yes | 40 | 40 | Gold | UL94 V-0 | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | 3.175mm | e4 | Closed Frame | 4 inch | 1 inch | 2 | RECTANGULAR | 0.165 inch | RND PIN-SKT | 0.1 inch | 0.9 mm | 40 (2 x 20) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.125 3.18mm | 0.100 2.54mm | 10.0μin 0.25μm | ||||||||||||||||||||||||||||
| 20-7800-10 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SIP | 700 | Through Hole | -55°C~105°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/arieselectronics-20782510-datasheets-7957.pdf | 7 Weeks | 2.54mm | yes | 20 | 40 | Tin | EAR99 | STANDARD: UL 94V-0 | Polyamide (PA46), Nylon 4/6, Glass Filled | e3 | Carrier, Elevated | 2 | 1.5A | 20 (1 x 20) | UL94 V-0 | 200.0μin 5.08μm | Phosphor Bronze | Phosphor Bronze | 0.100 2.54mm | 0.150 3.81mm | 0.100 2.54mm | 200.0μin 5.08μm |
