Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Part Status Type Series Mount Mounting Type Operating Temperature Packaging Moisture Sensitivity Level (MSL) Termination Max Operating Temperature Min Operating Temperature RoHS Status Published Datasheet Current Rating Package / Case Length Height Width Lead Free Factory Lead Time REACH SVHC Number of Pins Lead Pitch Pbfree Code Connector Type Number of Positions Number of Contacts Contact Finish - Mating Flammability Rating ECCN Code Additional Feature Contact Material Contact Plating Housing Material Lead Length HTS Code Insulation Resistance Contact Resistance JESD-609 Code Feature Terminal Pitch Operating Temperature (Max) Operating Temperature (Min) Pitch Body Length or Diameter Body Breadth Termination Type Number of Rows Row Spacing Device Socket Type Current Rating (Amps) Mounting Style Contact Finish Termination PCB Contact Pattern Body Depth Contact Style Mating Contact Pitch PCB Contact Row Spacing Dielectric Withstanding Voltage Device Type Used On Contact Configuration Number of Positions or Pins (Grid) Material Flammability Rating Contact Finish Thickness - Mating Contact Material - Mating Contact Material - Post Pitch - Mating Termination Post Length Pitch - Post Contact Finish - Post Contact Finish Thickness - Post
28-C182-20 28-C182-20 Aries Electronics
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0 0x0x0 download DIP, 0.6 (15.24mm) Row Spacing EJECT-A-DIP™ Surface Mount Through Hole -55°C~105°C Bulk 1 (Unlimited) Wire Wrap ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-14c28031-datasheets-8969.pdf 3A 5 Weeks 28 2.54mm yes 28 Gold UL94 V-0 EAR99 LATCHED, UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 1.016mm 1000000000Ohm e3 Closed Frame 1.69 inch 0.7 inch 2 RECTANGULAR RND PIN-SKT 0.1 inch 0.6 mm 1000VAC V 28 (2 x 14) UL94 V-0 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm 0.040 1.02mm 0.100 2.54mm Tin 200.0μin 5.08μm
116-43-322-61-001000 116-43-322-61-001000 Mill-Max Manufacturing Corp.
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0 0x0x0 download ROHS3 Compliant 3 Weeks
28-C212-20 28-C212-20 Aries Electronics
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0 0x0x0 download DIP, 0.6 (15.24mm) Row Spacing EJECT-A-DIP™ Surface Mount Through Hole -55°C~105°C Bulk 1 (Unlimited) Wire Wrap ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-14c28031-datasheets-8969.pdf 3A 5 Weeks 28 2.54mm yes 28 Gold UL94 V-0 EAR99 LATCHED, UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 1.016mm 1000000000Ohm e3 Closed Frame 1.69 inch 0.7 inch 2 RECTANGULAR RND PIN-SKT 0.1 inch 0.6 mm 1000VAC V 28 (2 x 14) UL94 V-0 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm 0.040 1.02mm 0.100 2.54mm Tin 200.0μin 5.08μm
48-6570-10 48-6570-10 Aries Electronics
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0 0x0x0 download DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 57 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2007 https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf 1A Lead Free 5 Weeks yes 48 48 Tin UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled 2.794mm 1000000000Ohm e3 Closed Frame 2.54mm 105°C 2.99 inch 0.9 inch RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 0.6 mm 1000VAC V 48 (2 x 24) UL94 V-0 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 200.0μin 5.08μm
48-6574-10 48-6574-10 Aries Electronics
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0 0x0x0 download DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 57 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2008 /files/arieselectronics-24657410-datasheets-8308.pdf 76mm 11.9mm 22.9mm Lead Free 5 Weeks No SVHC yes DIP 48 48 Gold EAR99 STANDARD: UL 94V-0 Copper Tin Polyphenylene Sulfide (PPS), Glass Filled 1000000000Ohm e3 Closed Frame 2.54mm 105°C 0.9 inch 15.24 mm 1A RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 1000VAC V 48 (2 x 24) UL94 V-0 10.0μin 0.25μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 10.0μin 0.25μm
48-6573-10 48-6573-10 Aries Electronics
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0 0x0x0 download DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 57 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2005 https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf 1A 5 Weeks yes 48 48 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Gold, Tin Polyphenylene Sulfide (PPS), Glass Filled 2.794mm 1000000000Ohm e3 Closed Frame 2.54mm 105°C 2.99 inch 0.9 inch RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 0.6 mm 1000VAC V 48 (2 x 24) UL94 V-0 10.0μin 0.25μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 10.0μin 0.25μm
515-93-155-16-003002 515-93-155-16-003002 Mill-Max Manufacturing Corp.
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0 0x0x0 download Non-RoHS Compliant 1A 3 Weeks no 155 GOLD (30) OVER NICKEL (100) EAR99 LOW PROFILE NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 10000000000Ohm e0 2.54mm 125°C -55°C 1.6 inch 1.6 inch SOLDER IC SOCKET STRAIGHT Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier RECTANGULAR 0.122 inch RND PIN-SKT 0.1 inch 0.1 mm 1000VAC V PGA155 16X16
48-3570-10 48-3570-10 Aries Electronics
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0 0x0x0 download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 57 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2005 /files/arieselectronics-24657410-datasheets-8308.pdf 1A 5 Weeks yes 48 48 Tin UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled 2.794mm e3 Closed Frame 48 (2 x 24) UL94 V-0 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 200.0μin 5.08μm
48-3573-10 48-3573-10 Aries Electronics
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0 0x0x0 download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 57 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2005 https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf 1A 5 Weeks yes 48 48 Tin UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled 2.794mm e3 Closed Frame 48 (2 x 24) UL94 V-0 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 200.0μin 5.08μm
28-3551-11 28-3551-11 Aries Electronics
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0 0x0x0 download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 55 Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2013 https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf 4 Weeks yes 28 Gold EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled e4 Closed Frame 1A 28 (2 x 14) UL94 V-0 Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm
34-0511-11 34-0511-11 Aries Electronics
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0 0x0x0 download SIP 511 Through Hole Through Hole -55°C~125°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-12051110-datasheets-7232.pdf 1A 7 Weeks 2.54mm yes 34 34 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 3.81mm e4 3.45 inch 1 RECTANGULAR 0.26 inch SQ PIN-SKT 34 (1 x 34) UL94 V-0 10.0μin 0.25μm Phosphor Bronze Phosphor Bronze 0.100 2.54mm 0.150 3.81mm 0.100 2.54mm 10.0μin 0.25μm
28-3553-11 28-3553-11 Aries Electronics
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0 0x0x0 download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 55 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2013 https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf 1A 4 Weeks 28 2.54mm yes 28 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled 2.794mm e4 Closed Frame 2 28 (2 x 14) UL94 V-0 Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm
28-3552-11 28-3552-11 Aries Electronics
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0 0x0x0 download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 55 Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2013 /files/arieselectronics-40655411-datasheets-2991.pdf 4 Weeks yes 28 Gold EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled e4 Closed Frame 1A 28 (2 x 14) UL94 V-0 Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm
510-91-012-05-001001 510-91-012-05-001001 Mill-Max Manufacturing Corp.
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0 0x0x0 download Non-RoHS Compliant 1A 3 Weeks no 12 GOLD (10) OVER NICKEL (100) EAR99 PGA SOCKET NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 10000000000Ohm e0 2.54mm 125°C -55°C 0.5 inch 0.5 inch SOLDER IC SOCKET STRAIGHT Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier RECTANGULAR 0.165 inch RND PIN-SKT 0.1 inch 0.1 mm 1000VAC V PGA12 5X5
517-87-370-19-121111 517-87-370-19-121111 Preci-Dip
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0 0x0x0 download PGA 517 Through Hole Through Hole -55°C~125°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2012 https://pdf.utmel.com/r/datasheets/precidip-5178318314091111-datasheets-3978.pdf 1A 10 Weeks 370 Gold UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 3.175mm 10mOhm Open Frame 370 (19 x 19) UL94 V-0 Flash Beryllium Copper Brass 0.100 2.54mm 0.125 3.18mm 0.100 2.54mm Tin
28-6551-11 28-6551-11 Aries Electronics
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0 0x0x0 download DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 55 Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2013 https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf 4 Weeks yes 28 Gold EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled e4 Closed Frame 1A 28 (2 x 14) UL94 V-0 Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm
48-3571-10 48-3571-10 Aries Electronics
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0 0x0x0 download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 57 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2005 https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf 1A 5 Weeks yes 48 48 Tin UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled 2.794mm e3 Closed Frame 48 (2 x 24) UL94 V-0 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 200.0μin 5.08μm
116-43-624-61-008000 116-43-624-61-008000 Mill-Max Manufacturing Corp.
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65-PGM10008-11 65-PGM10008-11 Aries Electronics $17.87
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0 0x0x0 download PGA PGM Through Hole Through Hole -55°C~125°C Bulk 1 (Unlimited) Solder 125°C -55°C ROHS3 Compliant 2009 https://pdf.utmel.com/r/datasheets/arieselectronics-80pgm1505910-datasheets-3551.pdf 3A 6 Weeks Gold UL94 V-0 Gold Polyamide (PA46), Nylon 4/6, Glass Filled 4.191mm 3A UL94 V-0 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm 0.165 4.19mm 0.100 2.54mm Gold 10.0μin 0.25μm
48-3572-10 48-3572-10 Aries Electronics
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0 0x0x0 download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 57 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2005 https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf 1A 5 Weeks yes 48 48 Tin UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled 2.794mm e3 Closed Frame 48 (2 x 24) UL94 V-0 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 200.0μin 5.08μm
515-93-155-16-003003 515-93-155-16-003003 Mill-Max Manufacturing Corp.
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0 0x0x0 download Non-RoHS Compliant 3 Weeks no 155 GOLD (30) OVER NICKEL (100) EAR99 PGA SOCKET NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 e0 IC SOCKET Tin/Lead (Sn/Pb) PGA155
511-91-052-09-045003 511-91-052-09-045003 Mill-Max Manufacturing Corp.
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48-3575-10 48-3575-10 Aries Electronics
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0 0x0x0 download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 57 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2007 https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf 1A 5 Weeks yes 48 48 Tin UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled 2.794mm e3 Closed Frame 48 (2 x 24) UL94 V-0 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 200.0μin 5.08μm
515-93-155-18-121003 515-93-155-18-121003 Mill-Max Manufacturing Corp.
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0 0x0x0 download Non-RoHS Compliant 3 Weeks no 155 GOLD (30) OVER NICKEL (100) EAR99 PGA SOCKET NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 e0 IC SOCKET Tin/Lead (Sn/Pb) PGA155
123-47-964-41-001000 123-47-964-41-001000 Mill-Max Manufacturing Corp.
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515-13-155-18-121002 515-13-155-18-121002 Mill-Max Manufacturing Corp.
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0 0x0x0 download ROHS3 Compliant 1A 3 Weeks yes 155 GOLD (30) OVER NICKEL (100) EAR99 LOW PROFILE NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 10000000000Ohm e4 2.54mm 125°C -55°C 1.8 inch 1.8 inch SOLDER IC SOCKET STRAIGHT Gold (Au) - with Nickel (Ni) barrier RECTANGULAR 0.122 inch RND PIN-SKT 0.1 inch 0.1 mm 1000VAC V PGA155 18X18
515-93-154-13-021002 515-93-154-13-021002 Mill-Max Manufacturing Corp.
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110-43-636-61-105000 110-43-636-61-105000 Mill-Max Manufacturing Corp.
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38-0501-21 38-0501-21 Aries Electronics
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0 0x0x0 download SIP 501 Through Hole Through Hole -55°C~125°C Bulk 1 (Unlimited) Wire Wrap 125°C -55°C ROHS3 Compliant 2013 https://pdf.utmel.com/r/datasheets/arieselectronics-02050130-datasheets-3742.pdf 1A SIP 7 Weeks 2.54mm 38 Gold UL94 V-0 Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.668mm 2.54mm 1 1A 38 (1 x 38) UL94 V-0 10.0μin 0.25μm Phosphor Bronze Phosphor Bronze 0.100 2.54mm 0.420 10.67mm 0.100 2.54mm Gold 10.0μin 0.25μm
614-43-964-31-002000 614-43-964-31-002000 Mill-Max Manufacturing Corp.
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0 0x0x0 download Through Hole ROHS3 Compliant 3 Weeks 64 yes 64 GOLD (30) OVER NICKEL (100) EAR99 NOT SPECIFIED PLASTIC 8536.90.40.00 e3 IC SOCKET Tin (Sn)

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