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Transistor Sockets(21155)

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Part Status Type Series Mount Mounting Type Operating Temperature Packaging Moisture Sensitivity Level (MSL) Termination Max Operating Temperature Min Operating Temperature RoHS Status Published Datasheet Current Rating Lead Free Factory Lead Time Number of Pins Lead Pitch Pbfree Code Number of Positions Gender Number of Contacts Contact Finish - Mating Orientation Flammability Rating ECCN Code Additional Feature Contact Material Contact Plating Housing Material Radiation Hardening Lead Length HTS Code Insulation Resistance Contact Resistance JESD-609 Code Feature Terminal Pitch Operating Temperature (Max) Pitch Body Length or Diameter Body Breadth Number of Rows Device Socket Type Current Rating (Amps) Contact Finish Termination PCB Contact Pattern Body Depth Contact Style Mating Contact Pitch PCB Contact Row Spacing Dielectric Withstanding Voltage Device Type Used On Number of Positions or Pins (Grid) Material Flammability Rating Contact Finish Thickness - Mating Contact Material - Mating Contact Material - Post Pitch - Mating Termination Post Length Pitch - Post Contact Finish - Post Contact Finish Thickness - Post
48-6556-11 48-6556-11 Aries Electronics
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 0 0x0x0 download DIP, 0.6 (15.24mm) Row Spacing 6556 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-24655620-datasheets-9089.pdf 3A 4 Weeks yes 48 48 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled 3.302mm e4 Open Frame 2.54mm 150°C 2.99 inch 1.27 inch RECTANGULAR 0.29 inch RND PIN-SKT 0.1 inch 0.6 mm 48 (2 x 24) UL94 V-0 30.0μin 0.76μm Beryllium Copper Brass 0.100 2.54mm 0.130 3.30mm 0.100 2.54mm 10.0μin 0.25μm
614-43-100-10-000012 614-43-100-10-000012 Mill-Max Manufacturing Corp.
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 0 0x0x0 download ROHS3 Compliant 3 Weeks yes 100 GOLD (30) OVER NICKEL (100) EAR99 LOW PROFILE NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 e3 IC SOCKET Tin (Sn) PGA100
24-3570-11 24-3570-11 Aries Electronics
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 0 0x0x0 download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 57 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2005 https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf 1A 5 Weeks yes 24 24 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled 2.794mm e4 Closed Frame 24 (2 x 12) UL94 V-0 10.0μin 0.25μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 10.0μin 0.25μm
36-81250-610C 36-81250-610C Aries Electronics
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 0 0x0x0 download DIP, 0.6 (15.24mm) Row Spacing 8 Through Hole Through Hole -55°C~105°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2007 https://pdf.utmel.com/r/datasheets/arieselectronics-1281250310c-datasheets-6393.pdf 3A 6 Weeks yes 36 36 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 3.556mm e3 Closed Frame, Elevated 36 (2 x 18) UL94 V-0 30.0μin 0.76μm Beryllium Copper Brass 0.100 2.54mm 0.140 3.56mm 0.100 2.54mm 10.0μin 0.25μm
515-13-121-15-061002 515-13-121-15-061002 Mill-Max Manufacturing Corp.
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 0 0x0x0 download ROHS3 Compliant 3 Weeks yes 121 GOLD (30) OVER NICKEL (100) EAR99 PGA SOCKET NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 e4 IC SOCKET Gold (Au) PGA121
515-13-121-13-061003 515-13-121-13-061003 Mill-Max Manufacturing Corp.
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 0 0x0x0 download ROHS3 Compliant 3 Weeks yes 121 GOLD (30) OVER NICKEL (100) EAR99 PGA SOCKET NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 e4 IC SOCKET Gold (Au) PGA121
24-6575-11 24-6575-11 Aries Electronics
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 0 0x0x0 download DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 57 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2005 https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf 1A 5 Weeks yes 24 24 Tin UL94 V-0 EAR99 STANDARD: UL 94V-0 Gold, Tin Polyphenylene Sulfide (PPS), Glass Filled 2.794mm 1000000000Ohm e4 Closed Frame 2.54mm 150°C 1.79 inch 0.9 inch RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 0.6 mm 1000VAC V 24 (2 x 12) UL94 V-0 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 200.0μin 5.08μm
110-91-422-61-001000 110-91-422-61-001000 Mill-Max Manufacturing Corp.
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 0 0x0x0 download Non-RoHS Compliant 3 Weeks
116-43-306-61-008000 116-43-306-61-008000 Mill-Max Manufacturing Corp.
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 0 0x0x0 download ROHS3 Compliant 3 Weeks
116-43-308-61-003000 116-43-308-61-003000 Mill-Max Manufacturing Corp.
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 0 0x0x0 download ROHS3 Compliant 3 Weeks
515-13-120-13-061002 515-13-120-13-061002 Mill-Max Manufacturing Corp.
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 0 0x0x0 download ROHS3 Compliant 3 Weeks yes 120 GOLD (30) OVER NICKEL (100) EAR99 PGA SOCKET NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 e4 IC SOCKET Gold (Au) PGA120
515-13-121-11-000003 515-13-121-11-000003 Mill-Max Manufacturing Corp.
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 0 0x0x0 download ROHS3 Compliant 3 Weeks yes 121 GOLD (30) OVER NICKEL (100) EAR99 PGA SOCKET NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 e4 IC SOCKET Gold (Au) PGA121
515-91-196-14-000003 515-91-196-14-000003 Mill-Max Manufacturing Corp.
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 0 0x0x0 download Non-RoHS Compliant 3 Weeks
110-41-422-61-001000 110-41-422-61-001000 Mill-Max Manufacturing Corp.
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 0 0x0x0 download ROHS3 Compliant 3 Weeks
68-PGM11033-11 68-PGM11033-11 Aries Electronics
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 0 0x0x0 download PGA PGM Through Hole Through Hole -55°C~125°C Bulk 1 (Unlimited) Solder 125°C -55°C ROHS3 Compliant 2009 https://pdf.utmel.com/r/datasheets/arieselectronics-80pgm1505910-datasheets-3551.pdf 3A 6 Weeks Gold UL94 V-0 Gold Polyamide (PA46), Nylon 4/6, Glass Filled 4.191mm 3A UL94 V-0 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm 0.165 4.19mm 0.100 2.54mm Gold 10.0μin 0.25μm
614-93-100-13-062001 614-93-100-13-062001 Mill-Max Manufacturing Corp.
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 0 0x0x0 download Non-RoHS Compliant 3 Weeks no 100 GOLD (30) OVER NICKEL (100) EAR99 LOW PROFILE NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 e0 IC SOCKET Tin/Lead (Sn/Pb) PGA100
515-13-121-13-061001 515-13-121-13-061001 Mill-Max Manufacturing Corp.
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Min: 1

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 0 0x0x0 download ROHS3 Compliant 3 Weeks yes 121 GOLD (30) OVER NICKEL (100) EAR99 LOW PROFILE NOT SPECIFIED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER 8536.90.40.00 e4 IC SOCKET Gold (Au) PGA121
517-87-364-17-091111 517-87-364-17-091111 Preci-Dip
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 0 0x0x0 download PGA 517 Through Hole Through Hole -55°C~125°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2012 https://pdf.utmel.com/r/datasheets/precidip-5178318314091111-datasheets-3978.pdf 1A 10 Weeks 364 Gold UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 3.175mm 10mOhm Open Frame 364 (17 x 17) UL94 V-0 Flash Beryllium Copper Brass 0.100 2.54mm 0.125 3.18mm 0.100 2.54mm Tin
32-6503-21 32-6503-21 Aries Electronics
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 0 0x0x0 download DIP, 0.6 (15.24mm) Row Spacing 503 Through Hole Through Hole -55°C~125°C Bulk 1 (Unlimited) Wire Wrap ROHS3 Compliant 2006 https://pdf.utmel.com/r/datasheets/arieselectronics-08250330-datasheets-7188.pdf 3A 5 Weeks 2.54mm 32 32 Gold UL94 V-0 EAR99 STANDARD: UL 94V-0 Polyamide (PA46), Nylon 4/6, Glass Filled 9.144mm Closed Frame 2 32 (2 x 16) UL94 V-0 10.0μin 0.25μm Beryllium Copper Phosphor Bronze 0.100 2.54mm 0.360 9.14mm 0.100 2.54mm 10.0μin 0.25μm
110-91-322-61-001000 110-91-322-61-001000 Mill-Max Manufacturing Corp.
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 0 0x0x0 download Non-RoHS Compliant 3 Weeks
APA-640-G-Q APA-640-G-Q Samtec Inc.
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 0 0x0x0 download Through Hole Bulk Not Applicable ROHS3 Compliant 2012 3 Weeks yes Male 40 Straight EAR99 STANDARD: UL 94V-0 BRASS/PHOSPHOR BRONZE POLYESTER No e4 2.54mm 2 IC SOCKET Gold (Au) - with Nickel (Ni) barrier
110-41-322-61-001000 110-41-322-61-001000 Mill-Max Manufacturing Corp.
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 0 0x0x0 download ROHS3 Compliant 3 Weeks
517-83-265-12-000111 517-83-265-12-000111 Preci-Dip
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 0 0x0x0 download PGA 517 Through Hole Through Hole -55°C~125°C Bulk 1 (Unlimited) Solder ROHS3 Compliant 2012 https://pdf.utmel.com/r/datasheets/precidip-5178318314091111-datasheets-3978.pdf 1A 10 Weeks 265 Gold UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 3.175mm 10mOhm Open Frame 265 (12 x 12) UL94 V-0 29.5μin 0.75μm Beryllium Copper Brass 0.100 2.54mm 0.125 3.18mm 0.100 2.54mm Tin
110-43-308-61-105000 110-43-308-61-105000 Mill-Max Manufacturing Corp.
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 0 0x0x0 download ROHS3 Compliant 3 Weeks
115-93-210-61-001000 115-93-210-61-001000 Mill-Max Manufacturing Corp.
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 0 0x0x0 download Non-RoHS Compliant 3 Weeks
546-83-169-17-101135 546-83-169-17-101135 Preci-Dip
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 0 0x0x0 download PGA 546 Through Hole Through Hole -55°C~125°C Bulk 1 (Unlimited) Press-Fit ROHS3 Compliant 2012 /files/precidip-5468712113061135-datasheets-9727.pdf 1A 10 Weeks 169 yes Gold UL94 V-0 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 2.4892mm 10mOhm Open Frame 169 (17 x 17) UL94 V-0 29.5μin 0.75μm Beryllium Copper Bronze 0.050 1.27mm 0.098 2.50mm 0.100 2.54mm Tin
68-PGM11032-11 68-PGM11032-11 Aries Electronics
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 0 0x0x0 download PGA PGM Through Hole Through Hole -55°C~125°C Bulk 1 (Unlimited) Solder 125°C -55°C ROHS3 Compliant 2009 https://pdf.utmel.com/r/datasheets/arieselectronics-80pgm1505910-datasheets-3551.pdf 3A Lead Free 6 Weeks Gold UL94 V-0 Gold Polyamide (PA46), Nylon 4/6, Glass Filled 4.191mm 3A UL94 V-0 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm 0.165 4.19mm 0.100 2.54mm Gold 10.0μin 0.25μm
24-6573-11 24-6573-11 Aries Electronics
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Min: 1

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 0 0x0x0 download DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 57 Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2005 /files/arieselectronics-24657410-datasheets-8308.pdf 5 Weeks yes 24 Gold EAR99 STANDARD: UL 94V-0 Polyphenylene Sulfide (PPS), Glass Filled 1000000000Ohm e4 Closed Frame 2.54mm 150°C 1.79 inch 0.9 inch 1A RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 0.6 mm 1000VAC V 24 (2 x 12) UL94 V-0 10.0μin 0.25μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 10.0μin 0.25μm
110-43-306-61-105000 110-43-306-61-105000 Mill-Max Manufacturing Corp.
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Min: 1

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 0 0x0x0 download ROHS3 Compliant 3 Weeks
24-3574-11 24-3574-11 Aries Electronics
RFQ

Min: 1

Mult: 1

 0 0x0x0 download DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 57 Through Hole Through Hole Bulk 1 (Unlimited) Solder ROHS3 Compliant 2005 https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf 1A 5 Weeks yes 24 24 Tin UL94 V-0 EAR99 STANDARD: UL 94V-0 Gold, Tin Polyphenylene Sulfide (PPS), Glass Filled 2.794mm e4 Closed Frame 24 (2 x 12) UL94 V-0 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.100 2.54mm 0.110 2.78mm 0.100 2.54mm 200.0μin 5.08μm
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