Products
Manufacturer
RFQ
NEWS
ContactMemory(55331)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Data Bus Width | Frequency (Max) | Output Characteristics | Access Time | Programming Voltage | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Alternate Memory Width | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | Data Polling | Toggle Bit | Number of Sectors/Size | Sector Size | Ready/Busy | Boot Block | Page Size | I/O Type | Standby Voltage-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MX29SL802CBXHI-90G | Macronix |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | CMOS | ASYNCHRONOUS | 0.75mm | RoHS Compliant | TFBGA | 6mm | 5mm | 1.8V | Lead Free | 48 | Parallel | 8 Mb | EAR99 | unknown | 8542.32.00.51 | 1 | YES | BOTTOM | BALL | NOT SPECIFIED | 1.8V | 0.5mm | 48 | INDUSTRIAL | 2.2V | 1.65V | NOT SPECIFIED | Flash Memories | 1.8/2V | 0.025mA | Not Qualified | R-PBGA-B48 | FLASH, NOR | 90 ns | 512KX16 | 16 | 8 | 0.000005A | YES | YES | 12115 | 16K8K32K64K | YES | BOTTOM | ||||||||||||||||||||||||||||||||||||
| TC58BVG1S3HTAI0 | Toshiba |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 85°C | -40°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/toshiba-tc58bvg1s3htai0-datasheets-6675.pdf | TFSOP | 20mm | 12mm | 3.6V | 2.7V | 48 | Parallel | 256MB | EEPROM, NAND | 8b | 40 μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71V3557S75PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3557s75pfg8-datasheets-6669.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 275mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 100MHz | 3-STATE | 7.5 ns | 17b | 0.04A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||||||
| 70V3579S4BC8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3579s4bc8-datasheets-6665.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 1.1 Mb | no | 1.4mm | 2 | PIPELINED OUTPUT MODE, SELF-TIMED WRITE CYCLE | No | 1 | 460mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | COMMERCIAL | SRAMs | RAM, SRAM | 3-STATE | 4.2 ns | 30b | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||||||||||
| IDT71V424YS10PHI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v424ys10phi-datasheets-6622.pdf | TSOP | Parallel | RAM, SRAM - Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71T75902S80BG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 2.36mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75902s80bg8-datasheets-6603.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 2.5V | 1.27mm | 119 | COMMERCIAL | 2.625V | 2.375V | NOT SPECIFIED | SRAMs | 2.5V | 0.25mA | Not Qualified | RAM, SRAM | 3-STATE | 95MHz | 1MX18 | 18 | 18874368 bit | 0.04A | 8 ns | COMMON | 2.38V | |||||||||||||||||||||||||||||||||||
| IDT70824S35PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | ASYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt70824s35pf-datasheets-6599.pdf | LQFP | 14mm | 14mm | 80 | Parallel | EAR99 | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 5V | 0.65mm | 80 | COMMERCIAL | 5.5V | 4.5V | 20 | Other Memory ICs | 5V | 0.34mA | Not Qualified | S-PQFP-G80 | RAM | 4KX16 | 16 | 65536 bit | 0.015A | 35 ns | ||||||||||||||||||||||||||||||||||||||||
| 70V06L20JGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | 4.57mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v06l20jgi-datasheets-6548.pdf | PLCC | 24mm | 24mm | 3.3V | Lead Free | 68 | 7 Weeks | 3.6V | 3V | 68 | Parallel | 128 kb | yes | 3.63mm | 2 | EAR99 | No | 1 | 195mA | e3 | MATTE TIN | QUAD | J BEND | 260 | 3.3V | 68 | INDUSTRIAL | RAM, SRAM | 20 ns | 28b | 16KX8 | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||
| 71V124SA15PHGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v124sa15phgi8-datasheets-6540.pdf | TSOP | 20.95mm | 10.16mm | 3.3V | Lead Free | 32 | 7 Weeks | 3.6V | 3V | 32 | Parallel | 1 Mb | yes | 1mm | 1 | No | 1 | 120mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 32 | INDUSTRIAL | 30 | SRAMs | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 15 ns | 17b | 8b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||||||||||||||||
| MX29SL800CBXEI-90G | Macronix |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | CMOS | ASYNCHRONOUS | 1.3mm | RoHS Compliant | 8mm | 6mm | 1.8V | Lead Free | 48 | Parallel | 8 Mb | EAR99 | unknown | 8542.32.00.51 | 1 | YES | BOTTOM | BALL | NOT SPECIFIED | 1.8V | 0.8mm | 48 | INDUSTRIAL | 2.2V | 1.65V | NOT SPECIFIED | Flash Memories | 1.8/2V | 0.025mA | Not Qualified | R-PBGA-B48 | FLASH, NOR | 90 ns | 512KX16 | 16 | 8 | 0.000005A | YES | YES | 12115 | 16K8K32K64K | YES | BOTTOM | |||||||||||||||||||||||||||||||||||||
| 71V3557S75PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3557s75pfg-datasheets-6524.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | FLOW-THROUGH ARCHITECHTURE | No | 1 | 275mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 100MHz | 3-STATE | 7.5 ns | 17b | 0.04A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||||||
| TC58BVG1S3HTA00 | Toshiba |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | CMOS | ASYNCHRONOUS | 1.2mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/toshiba-tc58bvg1s3hta00-datasheets-6522.pdf | TFSOP | 18.4mm | 12mm | 3.3V | 48 | 16 Weeks | 3.6V | 2.7V | Parallel, Serial | 2 Gb | 1 | DUAL | GULL WING | 3.3V | 0.5mm | COMMERCIAL | R-PDSO-G48 | EEPROM, NAND, SLC NAND | 256MX8 | 8 | 2kB | |||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V2559S85BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 2.36mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v2559s85bg-datasheets-6513.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | 119 | COMMERCIAL | 3.465V | 3.135V | NOT SPECIFIED | SRAMs | 2.5/3.3V | 0.225mA | Not Qualified | RAM, SRAM | 3-STATE | 90MHz | 256KX18 | 18 | 4718592 bit | 0.04A | 8.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||||
| IDT71V424YS10PH8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v424ys10ph8-datasheets-6498.pdf | TSOP | Parallel | RAM, SRAM - Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71T75902S80BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 2.36mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75902s80bg-datasheets-6483.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 2.5V | 1.27mm | 119 | COMMERCIAL | 2.625V | 2.375V | NOT SPECIFIED | SRAMs | 2.5V | 0.25mA | Not Qualified | RAM, SRAM | 3-STATE | 95MHz | 1MX18 | 18 | 18874368 bit | 0.04A | 8 ns | COMMON | 2.38V | ||||||||||||||||||||||||||||||||||||
| 70121L25J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2008 | /files/integrateddevicetechnology-70121l25j-datasheets-6481.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 18 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 220mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 2.3kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 22b | 0.005A | 9b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||||||||||
| 7009L20PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7009l20pfi-datasheets-6465.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 1 Mb | no | 1.4mm | 2 | No | 1 | 360mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | INDUSTRIAL | 20 | SRAMs | 5V | 128kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 17b | 0.006A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||||
| TC58BVG1S3HBAI6 | Toshiba |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 85°C | -40°C | CMOS | ASYNCHRONOUS | 1mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/toshiba-tc58bvg1s3hbai6-datasheets-6423.pdf | BGA | 8mm | 6.5mm | 67 | 67 | Parallel | 1 | YES | BOTTOM | BALL | 3.3V | 0.8mm | 67 | INDUSTRIAL | 3.6V | 2.7V | EEPROM, NAND | 3.3V | 256MX8 | 8 | 2147483648 bit | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71256SA20TPG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.572mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71256sa20tpg-datasheets-6412.pdf | PDIP | 34.3mm | 7.62mm | 5V | Lead Free | 28 | 7 Weeks | 5.5V | 4.5V | 28 | Parallel | 256 kb | yes | 3.3mm | 1 | EAR99 | No | 1 | 145mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 5V | 2.54mm | 28 | COMMERCIAL | SRAMs | 5V | 32kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 20 ns | 15b | 32KX8 | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||||||||||
| 70V9079L6PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 52.6MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9079l6pf-datasheets-6397.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 256 kb | no | 1.4mm | 2 | EAR99 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 350mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 100 | COMMERCIAL | 32kB | RAM, SDR, SRAM | 6 ns | 30b | 8b | Synchronous | |||||||||||||||||||||||||||||||||||||
| IDT71V416L10YI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 85°C | -40°C | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416l10yi8-datasheets-6392.pdf | 44 | Parallel | RAM, SRAM - Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V2558S133BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | SYNCHRONOUS | 2.36mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v2558s133bg-datasheets-6389.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | 119 | COMMERCIAL | 3.465V | 3.135V | NOT SPECIFIED | SRAMs | 2.53.3V | 0.3mA | Not Qualified | RAM, SRAM | 3-STATE | 256KX18 | 18 | 4718592 bit | 0.04A | 4.2 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||||
| 7008S25PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7008s25pf-datasheets-6388.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 305mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 32b | 64KX8 | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||
| 7007L15PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7007l15pf-datasheets-6385.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 80 | 7 Weeks | 5.5V | 4.5V | 80 | Parallel | 256 kb | no | 1.4mm | 2 | EAR99 | SEMAPHORE; AUTOMATIC POWER DOWN | No | 1 | 285mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.65mm | 80 | COMMERCIAL | 20 | SRAMs | 5V | 32kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 30b | 0.005A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||
| 7037L20PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7037l20pf8-datasheets-6386.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 576 kb | no | 1.4mm | 2 | No | 1 | 300mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | RAM, SRAM | 3-STATE | 20 ns | 15b | 0.003A | 18b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||||
| 71V3559S85BG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 91MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3559s85bg8-datasheets-6387.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | No | 225mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | COMMERCIAL | SRAMs | 512kB | RAM, SDR, SRAM | 100MHz | 3-STATE | 8.5 ns | 18b | 0.04A | 18b | Synchronous | COMMON | |||||||||||||||||||||||||||||||||||
| 70V27L20PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 85°C | -40°C | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v27l20pfi8-datasheets-6382.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 7 Weeks | 3.6V | 3V | 100 | Parallel | 512 kb | 1.4mm | 2 | No | 230mA | 64kB | RAM, SDR, SRAM | 20 ns | 30b | 16b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71T75902S75PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Tape and Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 100MHz | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75902s75pfi8-datasheets-6367.pdf | TQFP | 20mm | 2.5V | 100 | 2.625V | 2.375V | 100 | Parallel | 18 Mb | 1 | FLOW-THROUGH ARCHITECTURE | not_compliant | 1 | 295mA | e0 | QUAD | GULL WING | 240 | 2.5V | 0.65mm | 100 | INDUSTRIAL | 20 | SRAMs | Not Qualified | RAM, SRAM | 3-STATE | 7.5 ns | 20b | 18 | 0.06A | 18b | Synchronous | COMMON | 2.38V | |||||||||||||||||||||||||||||||||||||
| IDT71V424YS10PH | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.2mm | Non-RoHS Compliant | 2009 | /files/integrateddevicetechnology-idt71v424ys10ph-datasheets-6366.pdf | TSOP | 18.41mm | 10.16mm | 44 | Parallel | yes | 3A991.B.2.A | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) - annealed | YES | DUAL | GULL WING | 260 | 3.3V | 0.8mm | 44 | COMMERCIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.18mA | Not Qualified | R-PDSO-G44 | RAM, SRAM - Asynchronous | 3-STATE | 512KX8 | 8 | 4194304 bit | 0.02A | 10 ns | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||
| 70V9269S7PRFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 83.3MHz | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9269s7prfi8-datasheets-6364.pdf | TQFP | 20mm | 14mm | 3.3V | Contains Lead | 128 | 7 Weeks | 3.6V | 3V | 128 | Parallel | 256 kb | no | 1.4mm | 2 | EAR99 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 370mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 128 | INDUSTRIAL | SRAMs | 32kB | RAM, SDR, SRAM | 3-STATE | 7 ns | 14b | 16KX16 | 16b | Synchronous | COMMON | 3V |
