Products
Manufacturer
RFQ
NEWS
ContactMemory(55331)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Programming Voltage | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 70V24S55J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v24s55j8-datasheets-8229.pdf | PLCC | 29.21mm | 29.21mm | 3.3V | Contains Lead | 84 | 7 Weeks | 3.6V | 3V | 84 | Parallel | 64 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 180mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 84 | COMMERCIAL | SRAMs | 8kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 24b | 4KX16 | 0.005A | 16b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||
| IDT71016S12PHGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Rail/Tube | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71016s12phgi-datasheets-8222.pdf | TSOP | 5V | 44 | 5.5V | 4.5V | 44 | Parallel | 1 Mb | yes | 1 | unknown | 1 | 210mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 5V | 0.8mm | 44 | INDUSTRIAL | 30 | SRAMs | 5V | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 12 ns | 16b | 16 | 16b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||
| IDT71V416L15Y8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416l15y8-datasheets-8215.pdf | 28.575mm | 10.16mm | 44 | 44 | Parallel | no | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 44 | COMMERCIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.16mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 256KX16 | 16 | 4194304 bit | 0.01A | 15 ns | COMMON | 3V | |||||||||||||||||||||||||||||
| 71V30L55TF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v30l55tf8-datasheets-8209.pdf | LQFP | 10mm | 10mm | 3.3V | Contains Lead | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 8 kb | no | 1.4mm | 2 | EAR99 | BATTERY BACKUP OPERATION | No | 1 | 105mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 64 | COMMERCIAL | 20 | SRAMs | 1kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 10b | 1KX8 | 0.003A | 8b | Asynchronous | COMMON | 3V | ||||||||||||||||||||||
| IDT6116SA45TPGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Through Hole | Rail/Tube | 85°C | -40°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt6116sa45tpgi-datasheets-8206.pdf | PDIP | 5V | 24 | 5.5V | 4.5V | 24 | Parallel | 16 kb | 1 | EAR99 | 1 | 100mA | e3 | MATTE TIN | DUAL | 260 | 5V | 2.54mm | 24 | INDUSTRIAL | 30 | SRAMs | 5V | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 45 ns | 11b | 2KX8 | 8 | 0.002A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||||||||
| 71V65603S133BGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | 2.36mm | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v65603s133bgi8-datasheets-8159.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 9 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 320mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | INDUSTRIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 4.2 ns | 18b | 256KX36 | 0.06A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||
| 71321LA20PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71321la20pfg8-datasheets-8158.pdf | TQFP | 14mm | 14mm | 5V | Lead Free | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 16 kb | yes | 1.4mm | 2 | EAR99 | AUTOMATIC POWER DOWN | No | 1 | e3 | Matte Tin (Sn) - annealed | YES | QUAD | GULL WING | 260 | 5V | 0.8mm | 64 | COMMERCIAL | 30 | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 22b | 0.0015A | COMMON | 2V | |||||||||||||||||||||||||
| 71V67803S133BQG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v67803s133bqg8-datasheets-8139.pdf | 15mm | 13mm | 3.3V | Lead Free | 165 | 7 Weeks | 165 | Parallel | 9 Mb | yes | 1.2mm | 1 | PIPELINED ARCHITECTURE | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 165 | COMMERCIAL | 3.465V | 30 | SRAMs | 0.26mA | RAM, SRAM | 3-STATE | 19b | 0.05A | 4.2 ns | COMMON | ||||||||||||||||||||||||||||||
| IDT71P74804S250BQG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 70°C | 0°C | 250MHz | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p74804s250bqg-datasheets-8129.pdf | 165 | Parallel | QDR, RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7134SA70P | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 70°C | 0°C | CMOS | 5.08mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7134sa70p-datasheets-8121.pdf | PDIP | 61.7mm | 15.24mm | 5V | Contains Lead | 48 | 5.5V | 4.5V | 48 | Parallel | 32 kb | no | 3.8mm | 2 | EAR99 | AUTOMATIC POWER-DOWN | No | 1 | 240mA | e0 | Tin/Lead (Sn85Pb15) | DUAL | 245 | 5V | 48 | COMMERCIAL | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 70 ns | 24b | 4KX8 | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||
| IDT6116SA45SOI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 1 (Unlimited) | 85°C | -40°C | CMOS | 2.65mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt6116sa45soi8-datasheets-8116.pdf | SOIC | 15.4mm | 7.5mm | 24 | Parallel | EAR99 | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | YES | DUAL | GULL WING | 225 | 5V | 1.27mm | 24 | INDUSTRIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.1mA | Not Qualified | R-PDSO-G24 | RAM, SRAM - Asynchronous | 3-STATE | 2KX8 | 8 | 16384 bit | 0.002A | 45 ns | COMMON | 4.5V | |||||||||||||||||||||||||||||
| IDT71V3557SA85BG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 2.36mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3557sa85bg8-datasheets-8110.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | 119 | COMMERCIAL | 3.465V | 3.135V | NOT SPECIFIED | SRAMs | 3.3V | 0.225mA | Not Qualified | RAM, SRAM | 3-STATE | 90MHz | 128KX36 | 36 | 4718592 bit | 0.04A | 8.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
| 70V9369L12PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 33.3MHz | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9369l12pf-datasheets-8097.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 288 kb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 205mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 20 | SRAMs | 36kB | RAM, SDR, SRAM | 83MHz | 3-STATE | 12 ns | 28b | 16KX18 | 0.005A | 18b | Synchronous | COMMON | 3V | |||||||||||||||||||||
| 71V3556SA133BQG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v3556sa133bqg8-datasheets-8048.pdf | 15mm | 13mm | 3.3V | Lead Free | 165 | 11 Weeks | 165 | Parallel | 4.5 Mb | yes | 1.2mm | 1 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 165 | COMMERCIAL | 3.465V | RAM, SRAM | 17b | 4.2 ns | |||||||||||||||||||||||||||||||||||||
| TC58NVG2S0HBAI4 | Toshiba |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 85°C | -40°C | CMOS | ASYNCHRONOUS | 1mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/toshiba-tc58nvg2s0hbai4-datasheets-8039.pdf | TFBGA | 11mm | 9mm | 63 | 4 Weeks | 63 | Parallel | 1 | YES | BOTTOM | BALL | 3.3V | 0.8mm | 63 | INDUSTRIAL | 3.6V | 2.7V | EEPROM, NAND | 3.3V | 512MX8 | 8 | 4294967296 bit | |||||||||||||||||||||||||||||||||||||||||||
| 70T3319S133BFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3319s133bfi8-datasheets-8037.pdf | 15mm | 15mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 4 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 450mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.8mm | 208 | INDUSTRIAL | SRAMs | RAM, SRAM | 3-STATE | 15 ns | 18b | 18b | Synchronous | COMMON | ||||||||||||||||||||||||||||
| 7134SA55J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7134sa55j-datasheets-8015.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 32 kb | no | 3.63mm | 2 | EAR99 | AUTOMATIC POWER-DOWN | No | 1 | 240mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 24b | 4KX8 | 0.015A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||
| 7130LA25TFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 85°C | -40°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7130la25tfi8-datasheets-8010.pdf | TQFP | 10mm | 10mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 8 kb | 1.4mm | 2 | No | 220mA | 1kB | RAM, SDR, SRAM | 25 ns | 10b | 8b | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||
| 71321SA35J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71321sa35j8-datasheets-8005.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | No | 1 | 165mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 22b | 0.015A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||
| IDT71V3557S75PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3557s75pf8-datasheets-7996.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.275mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 100MHz | 128KX36 | 36 | 4718592 bit | 0.04A | 7.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
| IDT71V3556S166PFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 166MHz | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3556s166pfi-datasheets-7990.pdf | TQFP | 20mm | 3.3V | 100 | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | 1 | not_compliant | 1 | 360mA | e0 | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 20 | SRAMs | Not Qualified | RAM, SRAM | 3-STATE | 3.5 ns | 17b | 36 | 0.045A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||||||||
| IDT71P74804S200BQG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | 200MHz | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p74804s200bqg8-datasheets-7991.pdf | 165 | Parallel | QDR, RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT6116SA45SOI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 1 (Unlimited) | 85°C | -40°C | CMOS | 2.65mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt6116sa45soi-datasheets-7987.pdf | SOIC | 15.4mm | 7.5mm | 24 | Parallel | EAR99 | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | YES | DUAL | GULL WING | 225 | 5V | 1.27mm | 24 | INDUSTRIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.1mA | Not Qualified | R-PDSO-G24 | RAM, SRAM - Asynchronous | 3-STATE | 2KX8 | 8 | 16384 bit | 0.002A | 45 ns | COMMON | 4.5V | ||||||||||||||||||||||||||||||
| 7134SA35J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7134sa35j-datasheets-7969.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 32 kb | no | 3.63mm | 2 | EAR99 | AUTOMATIC POWER-DOWN | No | 1 | 260mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 24b | 4KX8 | 0.015A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||
| TC58NVG1S3HBAI4 | Toshiba |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 85°C | -40°C | CMOS | ASYNCHRONOUS | 1mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/toshiba-tc58nvg1s3hbai4-datasheets-7962.pdf | TFBGA | 11mm | 9mm | 63 | 131 Weeks | 63 | Parallel | 1 | YES | BOTTOM | BALL | 3.3V | 0.8mm | 63 | INDUSTRIAL | 3.6V | 2.7V | EEPROM, NAND | 3.3V | 256MX8 | 8 | 2147483648 bit | |||||||||||||||||||||||||||||||||||||||||||
| 70T3599S133BFGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 85°C | -40°C | 133MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3599s133bfgi8-datasheets-7933.pdf | 15mm | 15mm | 2.5V | Lead Free | 2.6V | 2.4V | 208 | Parallel | 4.5 Mb | 1.4mm | 2 | No | 450mA | RAM, SRAM | 15 ns | 34b | 36b | Synchronous | |||||||||||||||||||||||||||||||||||||||||||||||
| IDT6116SA45SO8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 1 (Unlimited) | 70°C | 0°C | CMOS | 2.65mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt6116sa45so8-datasheets-7926.pdf | SOIC | 15.4mm | 7.5mm | 24 | Parallel | 1 | EAR99 | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | YES | DUAL | GULL WING | 225 | 5V | 1.27mm | 24 | COMMERCIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.1mA | Not Qualified | R-PDSO-G24 | RAM, SRAM - Asynchronous | 3-STATE | 2KX8 | 8 | 16384 bit | 0.002A | 45 ns | COMMON | 4.5V | YES | |||||||||||||||||||||||||||
| IDT71V016SA12YI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | Rail/Tube | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.683mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v016sa12yi-datasheets-7913.pdf | 28.575mm | 3.3V | 44 | 3.6V | 3V | 44 | Parallel | 1 Mb | 1 | not_compliant | 1 | 160mA | e0 | DUAL | J BEND | 225 | 3.3V | 44 | INDUSTRIAL | 30 | SRAMs | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 12 ns | 16b | 16 | 16b | Asynchronous | COMMON | ||||||||||||||||||||||||||||||||||
| IDT71P74804S200BQG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 70°C | 0°C | 200MHz | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71p74804s200bqg-datasheets-7908.pdf | 165 | Parallel | QDR, RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V256SA15PZI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.2mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v256sa15pzi8-datasheets-7886.pdf | TSSOP | 11.8mm | 8mm | 28 | Parallel | no | 1 | EAR99 | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | GULL WING | 240 | 3.3V | 0.55mm | 28 | INDUSTRIAL | 3.6V | 3V | 20 | SRAMs | 3.3V | 0.085mA | Not Qualified | R-PDSO-G28 | RAM, SRAM - Asynchronous | 3-STATE | 32KX8 | 8 | 262144 bit | 0.002A | 15 ns | COMMON | 3V | YES |
