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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | REACH SVHC | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Number of Ports | ECCN Code | Additional Feature | Contact Plating | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Power Supplies | Supply Current-Max | Qualification Status | Ambient Temperature Range High | JESD-30 Code | Supplier Device Package | Memory Size | Memory Type | Data Bus Width | Output Characteristics | Access Time | Programming Voltage | Clock Frequency | Address Bus Width | Memory Format | Memory Interface | Organization | Memory Width | Write Cycle Time - Word, Page | Memory Density | Parallel/Serial | Standby Current-Max | Word Size | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | I2C Control Byte | Access Time (Max) | Sync/Async | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Ready/Busy | Page Size | I/O Type | Refresh Cycles | Sequential Burst Length | Interleaved Burst Length | Standby Voltage-Min | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PCF8598C-2P/02,112 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | -40°C~85°C TA | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 4.2mm | ROHS3 Compliant | 2003 | https://pdf.utmel.com/r/datasheets/nxpusainc-pcf8598c2t02112-datasheets-4503.pdf | 8-DIP (0.300, 7.62mm) | 9.5mm | 7.62mm | 8 | 8542.32.00.71 | 1 | e4 | NICKEL PALLADIUM GOLD | NO | 2.5V~6.0V | DUAL | NOT SPECIFIED | 3.3V | 2.54mm | PCF8598 | 8 | 6V | 2.5V | NOT SPECIFIED | 3/5V | 0.002mA | Not Qualified | R-PDIP-T8 | 8Kb 1K x 8 | Non-Volatile | 100kHz | EEPROM | I2C | 1KX8 | 8 | 8192 bit | SERIAL | 0.00001A | I2C | 1000000 Write/Erase Cycles | 10ms | 10 | HARDWARE | 1010DMMR | ||||||||||||||||||||||||||||||||||||||||||||||||||
| S34ML02G100BHI003 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ML-1 | Surface Mount | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | 1mm | ROHS3 Compliant | 2012 | 63-VFBGA | 11mm | 3.3V | 63 | 4 Weeks | 63 | 2 Gb | No | 8542.32.00.51 | 1 | 30mA | 2.7V~3.6V | BOTTOM | 3.3V | 0.8mm | 3.6V | 2.7V | 2Gb 256M x 8 | Non-Volatile | 8b | 20 ns | 3V | 29b | FLASH | Parallel | 256MX8 | 8 | 25ns | 0.00005A | 8b | Asynchronous | NO | NO | YES | 2K | 128K | YES | 2Kwords | |||||||||||||||||||||||||||||||||||||||||||||||||||
| AS4C32M16SB-7BINTR | Alliance Memory, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | 3 (168 Hours) | SDRAM | ROHS3 Compliant | 54-TSOP (0.400, 10.16mm Width) | 3V~3.6V | 512Mb 32M x 16 | Volatile | 6ns | 143MHz | DRAM | Parallel | 14ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MR2A16ATS35C | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tray | 1 (Unlimited) | MRAM (Magnetoresistive RAM) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mr2a16ats35c-datasheets-4594.pdf | 44-TSOP (0.400, 10.16mm Width) | 3V~3.6V | MR2A16A | 4Mb 256K x 16 | Non-Volatile | RAM | Parallel | 35ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PCF8594C-2T/02,112 | NXP USA Inc. | $2.60 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 1.75mm | ROHS3 Compliant | 1998 | https://pdf.utmel.com/r/datasheets/nxpusainc-pcf8594c2p02112-datasheets-7576.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 8 | 7 Weeks | 8542.32.00.71 | 1 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | YES | 2.5V~6.0V | DUAL | 260 | 3.3V | 1.27mm | PCF8594 | 8 | 6V | 2.5V | 30 | 3/5V | 0.0008mA | Not Qualified | R-PDSO-G8 | 4Kb 512 x 8 | Non-Volatile | 100kHz | EEPROM | I2C | 512X8 | 8 | 4096 bit | SERIAL | 0.0000035A | I2C | 1000000 Write/Erase Cycles | 10ms | 10 | HARDWARE | |||||||||||||||||||||||||||||||||||||||||||||||||
| S34ML08G101TFI200 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ML-1 | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NAND | 1.2mm | ROHS3 Compliant | 2013 | 48-TFSOP (0.724, 18.40mm Width) | 18.4mm | Lead Free | 48 | 14 Weeks | No SVHC | 48 | 8 b | No | 8542.32.00.51 | 1 | 30mA | e3 | Matte Tin (Sn) | 2.7V~3.6V | DUAL | 3V | 0.5mm | 3.6V | 2.7V | 3/3.3V | 8Gb 1G x 8 | Non-Volatile | 8b | 25 ns | 3V | 31b | FLASH | Parallel | 1GX8 | 8 | 0.00005A | 8b | Asynchronous | NO | NO | YES | 8K | 128K | YES | 2Kwords | ||||||||||||||||||||||||||||||||||||||||||||||||
| TC58CVG1S3HRAIJ | Kioxia America, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | 3 (168 Hours) | FLASH - NAND | https://pdf.utmel.com/r/datasheets/kioxiaamericainc-tc58cvg1s3hraij-datasheets-4523.pdf | 8-WDFN Exposed Pad | 12 Weeks | 2.7V~3.6V | 2Gb 256M x 8 | Non-Volatile | 180μs | 133MHz | FLASH | SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PCF85103C-2P/00,11 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | -40°C~85°C TA | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 4.2mm | ROHS3 Compliant | 2000 | https://pdf.utmel.com/r/datasheets/nxpusainc-pcf85103c2t0011-datasheets-4501.pdf | 8-DIP (0.300, 7.62mm) | 9.5mm | 7.62mm | 8 | EAR99 | unknown | 8542.32.00.51 | 1 | e4 | NICKEL PALLADIUM GOLD | NO | 2.5V~6.0V | DUAL | NOT SPECIFIED | 3.3V | 2.54mm | PCF85103C-2 | 8 | 6V | 2.5V | NOT SPECIFIED | 3/5V | 0.002mA | Not Qualified | R-PDIP-T8 | 2Kb 256 x 8 | Non-Volatile | 100kHz | EEPROM | I2C | 256X8 | 8 | 2048 bit | SERIAL | 0.0000035A | I2C | 1000000 Write/Erase Cycles | 10ms | 10 | 1010DDDR | |||||||||||||||||||||||||||||||||||||||||||||||||
| MR0A16AYS35R | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 1 (Unlimited) | MRAM (Magnetoresistive RAM) | ROHS3 Compliant | 2015 | 44-TSOP (0.400, 10.16mm Width) | 3V~3.6V | MR0A16A | 44-TSOP II | 1Mb 64K x 16 | Non-Volatile | 35ns | RAM | Parallel | 35ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S34ML04G100BHI000 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ML-1 | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 2014 | 63-VFBGA | 11mm | 1mm | 9mm | 3.3V | Lead Free | 63 | 14 Weeks | No SVHC | 63 | 4 Gb | No | 8542.32.00.51 | 1 | 30mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 2.7V~3.6V | BOTTOM | 3.3V | 0.8mm | 3.6V | 2.7V | 85°C | 4Gb 512M x 8 | Non-Volatile | 8b | 25 ns | 3V | 30b | FLASH | Parallel | 512MX8 | 0.00005A | 8b | Asynchronous | NO | NO | YES | 4K | 128K | YES | 2kB | |||||||||||||||||||||||||||||||||||||||||||||||
| PCF85116-3T/01,112 | NXP USA Inc. | $6.00 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 1.75mm | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-pcf851163t01112-datasheets-4525.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 8 | EAR99 | 8542.32.00.51 | 1 | e4 | NICKEL PALLADIUM GOLD | YES | 2.7V~5.5V | DUAL | 260 | 3.3V | 1.27mm | PCF85116-3 | 8 | 5.5V | 2.7V | 30 | 3/5V | Not Qualified | R-PDSO-G8 | 16Kb 2K x 8 | Non-Volatile | 400kHz | EEPROM | I2C | 2KX8 | 8 | 16384 bit | SERIAL | I2C | 1000000 Write/Erase Cycles | 10ms | 20 | HARDWARE | 1010MMMR | ||||||||||||||||||||||||||||||||||||||||||||||||||
| PCA24S08AD,118 | NXP USA Inc. | $0.13 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | SYNCHRONOUS | 1.75mm | ROHS3 Compliant | 2003 | https://pdf.utmel.com/r/datasheets/nxpusainc-pca24s08adp118-datasheets-6807.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 8 | 7 Weeks | 8542.32.00.51 | 1 | e3 | Matte Tin (Sn) | YES | 2.5V~3.6V | DUAL | NOT SPECIFIED | 1.27mm | PCA24S08 | 8 | 3.6V | 2.5V | NOT SPECIFIED | 3/3.3V | 0.001mA | Not Qualified | R-PDSO-G8 | 8Kb 1K x 8 | Non-Volatile | 400kHz | EEPROM | I2C | 1MX8 | 8 | 8388608 bit | SERIAL | 0.000018A | I2C | 100000 Write/Erase Cycles | 10 | HARDWARE/SOFTWARE | 10101MMR | ||||||||||||||||||||||||||||||||||||||||||||||||||
| S34ML04G100BHI003 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ML-1 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ASYNCHRONOUS | 1mm | ROHS3 Compliant | 2009 | 63-VFBGA | 11mm | 63 | 63 | 8542.32.00.51 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | 2.7V~3.6V | BOTTOM | NOT SPECIFIED | 3.3V | 0.8mm | 3.6V | 2.7V | NOT SPECIFIED | 3/3.3V | 0.03mA | Not Qualified | 4Gb 512M x 8 | Non-Volatile | 8b | 25 ns | 3V | FLASH | Parallel | 512MX8 | 8 | 4294967296 bit | 0.00005A | NO | NO | YES | 4K | 128K | YES | 2Kwords | |||||||||||||||||||||||||||||||||||||||||||||||||||
| S34ML04G100TFI000 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ML-1 | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NAND | 33MHz | ROHS3 Compliant | 2014 | 48-TFSOP (0.724, 18.40mm Width) | 18.5mm | 1.2mm | 12.1mm | 3.3V | Lead Free | 48 | 14 Weeks | No SVHC | 48 | 4 Gb | Tin | No | 8542.32.00.51 | 1 | 30mA | e3 | 2.7V~3.6V | DUAL | 3.3V | 0.5mm | 3.6V | 2.7V | 85°C | 4Gb 512M x 8 | Non-Volatile | 8b | 20 ns | 3V | 30b | FLASH | Parallel | 512MX8 | 25ns | 0.00005A | 8b | Asynchronous | NO | NO | YES | 4K | 128K | YES | 2kB | |||||||||||||||||||||||||||||||||||||||||||||
| TC58CYG2S0HRAIJ | Kioxia America, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | 3 (168 Hours) | FLASH - NAND | https://pdf.utmel.com/r/datasheets/kioxiaamericainc-tc58cyg2s0hraij-datasheets-4536.pdf | 8-WDFN Exposed Pad | 12 Weeks | 1.7V~1.95V | 4Gb 512M x 8 | Non-Volatile | 300μs | 133MHz | FLASH | SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S34MS04G200BHI000 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MS-2 | Surface Mount | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NAND | 1mm | ROHS3 Compliant | 2013 | 63-VFBGA | 11mm | 1.8V | Lead Free | 20mA | 63 | 6 Weeks | No SVHC | 63 | 8 b | Copper, Silver, Tin | No | 8542.32.00.51 | 1 | 1.7V~1.95V | BOTTOM | 1.8V | 0.8mm | 1.95V | 1.7V | 4Gb 512M x 8 | Non-Volatile | 8b | 30b | FLASH | Parallel | 512MX8 | 8 | 45ns | 0.00005A | 45 ns | NO | NO | YES | 4K | 128K | YES | 2kB | |||||||||||||||||||||||||||||||||||||||||||||||||||
| S34ML08G101BHI003 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ML-1 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ASYNCHRONOUS | 1mm | ROHS3 Compliant | 2016 | 63-VFBGA | 11mm | 63 | 63 | 8542.32.00.51 | 1 | YES | 2.7V~3.6V | BOTTOM | NOT SPECIFIED | 3V | 0.8mm | 3.6V | 2.7V | NOT SPECIFIED | 3/3.3V | 0.03mA | Not Qualified | 8Gb 1G x 8 | Non-Volatile | 8b | 3V | FLASH | Parallel | 1GX8 | 8 | 25ns | 8589934592 bit | 0.00005A | 25 ns | NO | NO | YES | 8K | 128K | YES | 2Kwords | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| PCF85116-3T/01,118 | NXP USA Inc. | $0.55 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 1 (Unlimited) | CMOS | SYNCHRONOUS | 1.75mm | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-pcf851163t01112-datasheets-4525.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9mm | 3.9mm | 8 | EAR99 | 8542.32.00.51 | 1 | e4 | NICKEL PALLADIUM GOLD | YES | 2.7V~5.5V | DUAL | 260 | 3.3V | 1.27mm | PCF85116-3 | 8 | 5.5V | 2.7V | 30 | 3/5V | Not Qualified | R-PDSO-G8 | 16Kb 2K x 8 | Non-Volatile | 400kHz | EEPROM | I2C | 2KX8 | 8 | 16384 bit | SERIAL | I2C | 1000000 Write/Erase Cycles | 10ms | 20 | HARDWARE | 1010MMMR | ||||||||||||||||||||||||||||||||||||||||||||||||||
| F800BJHEPBTLT9 | Sharp Microelectronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | 85°C | -40°C | 90GHz | RoHS Compliant | 2003 | TSOP | Lead Free | Parallel | 7.6MB | FLASH | 90 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MB85RC16VPNF-G-JNE1 | Fujitsu Electronics America, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tray | 1 (Unlimited) | 85°C | -40°C | FRAM (Ferroelectric RAM) | 400kHz | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/fujitsuelectronicsamericainc-mb85rc16vpnfgjnn1ere1-datasheets-4057.pdf | 8-SOIC (0.154, 3.90mm Width) | Unknown | 5.5V | 3V | 8 | 2-Wire, I2C, Serial | 16 kb | No | 3V~5.5V | 8-SOP | 16Kb 2K x 8 | Non-Volatile | 8b | 550ns | 1MHz | FRAM | I2C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| HYB25D128800CE-6 | Qimonda |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Cut Tape (CT) | 1 (Unlimited) | SDRAM - DDR | SYNCHRONOUS | 1.2mm | RoHS Compliant | 2006 | https://pdf.utmel.com/r/datasheets/qimonda-hyb25d128800ce6-datasheets-4564.pdf | 66-TSSOP (0.400, 10.16mm Width) | 22.22mm | 10.16mm | Lead Free | 66 | 66 | 1 | EAR99 | AUTO/SELF REFRESH | unknown | 8542.32.00.02 | 1 | e3 | Matte Tin (Sn) | YES | 2.3V~2.7V | DUAL | 260 | 2.5V | 0.65mm | 66 | 2.7V | 2.3V | 40 | 2.5V | 0.215mA | Not Qualified | 128Mb 16M x 8 | Volatile | 3-STATE | 166 μs | 166MHz | DRAM | Parallel | 16MX8 | 8 | 134217728 bit | 0.0045A | COMMON | 4096 | 248 | 248 | |||||||||||||||||||||||||||||||||||||||||||||||
| S34ML04G100TFI003 | Cypress Semiconductor Corp |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | ML-1 | Surface Mount | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | 1.2mm | ROHS3 Compliant | 2014 | 48-TFSOP (0.724, 18.40mm Width) | 18.4mm | 3.3V | 48 | 99 Weeks | 48 | 4 Gb | No | 8542.32.00.51 | 1 | 30mA | e3 | Matte Tin (Sn) | 2.7V~3.6V | DUAL | 3.3V | 0.5mm | 3.6V | 2.7V | 4Gb 512M x 8 | Non-Volatile | 8b | 20 ns | 3V | 30b | FLASH | Parallel | 512MX8 | 8 | 25ns | 0.00005A | 8b | Asynchronous | NO | NO | YES | 4K | 128K | YES | 2kB | |||||||||||||||||||||||||||||||||||||||||||||||||
| PCF8570T/F5,512 | NXP USA Inc. | $1.81 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tube | 2 (1 Year) | CMOS | SYNCHRONOUS | 2.65mm | ROHS3 Compliant | 1999 | https://pdf.utmel.com/r/datasheets/nxpusainc-pcf8570tf5518-datasheets-0339.pdf | 8-SOIC (0.295, 7.50mm Width) | 7.55mm | 7.5mm | 8 | 7 Weeks | 1 | 8542.39.00.01 | 1 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | YES | 2.5V~6V | DUAL | 260 | 5V | 1.27mm | PCF8570 | 8 | 6V | 2.5V | 30 | 3/5V | 0.0002mA | Not Qualified | R-PDSO-G8 | 2Kb 256 x 8 | Volatile | OPEN-DRAIN | 100kHz | SRAM | I2C | 256X8 | 8 | 2048 bit | SERIAL | 4e-7A | 3400 ns | COMMON | 1V | NO | ||||||||||||||||||||||||||||||||||||||||||||||||
| PCA8581T/6,112 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -25°C~85°C TA | Tube | 1 (Unlimited) | ROHS3 Compliant | 1997 | https://pdf.utmel.com/r/datasheets/nxpusainc-pca8581pf6112-datasheets-4514.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.5V~5.5V | PCA8581 | 1Kb 128 x 8 | Non-Volatile | 100kHz | EEPROM | I2C | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q16FWUUIQ | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | FLASH - NOR | SYNCHRONOUS | 0.6mm | RoHS Compliant | 2016 | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q16fwsnigtr-datasheets-9309.pdf | 8-UDFN Exposed Pad | 4mm | 3mm | 8 | compliant | 1 | YES | 1.65V~1.95V | DUAL | NOT SPECIFIED | 1.8V | 0.8mm | 1.95V | 1.65V | NOT SPECIFIED | R-PDSO-N8 | 16Mb 2M x 8 | Non-Volatile | 1.8V | 104MHz | FLASH | SPI - Quad I/O, QPI | 16MX1 | 1 | 60μs, 3ms | 16777216 bit | SERIAL | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PCF8582C-2P/03,112 | NXP USA Inc. | $0.66 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | -40°C~85°C TA | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 4.2mm | ROHS3 Compliant | 1998 | https://pdf.utmel.com/r/datasheets/nxpusainc-pcf8582c2t03118-datasheets-4322.pdf | 8-DIP (0.300, 7.62mm) | 9.5mm | 7.62mm | 8 | 8542.32.00.71 | 1 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | NO | 2.5V~6.0V | DUAL | NOT SPECIFIED | 3.3V | 2.54mm | PCF8582 | 8 | 6V | 2.5V | NOT SPECIFIED | 3/5V | 0.002mA | Not Qualified | R-PDIP-T8 | 2Kb 256 x 8 | Non-Volatile | 100kHz | EEPROM | I2C | 256X8 | 8 | 2048 bit | SERIAL | 0.0000035A | I2C | 1000000 Write/Erase Cycles | 10ms | 10 | 1010DDDR | ||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q16JWBYIQ | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tube | FLASH - NOR | https://pdf.utmel.com/r/datasheets/winbondelectronics-w25q16jwsnimtr-datasheets-8530.pdf | 8-UFBGA, WLCSP | compliant | 1.65V~1.95V | 16Mb 2M x 8 | Non-Volatile | 133MHz | FLASH | SPI - Quad I/O | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q16JWUUIM TR | Winbond Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | SpiFlash® | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | FLASH - NOR | 8-UDFN Exposed Pad | 1.65V~1.95V | 16Mb 2M x 8 | Non-Volatile | 133MHz | FLASH | SPI - Quad I/O | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| F640BFHEPTTLHFA | Sharp Microelectronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tray | 3 (168 Hours) | 85°C | -40°C | 70GHz | RoHS Compliant | 2011 | TSOP | Lead Free | Parallel | 61MB | FLASH | 70 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| TC58CVG0S3HRAIJ | Kioxia America, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | 3 (168 Hours) | FLASH - NAND | https://pdf.utmel.com/r/datasheets/kioxiaamericainc-tc58cvg0s3hraij-datasheets-4498.pdf | 8-WDFN Exposed Pad | 12 Weeks | 2.7V~3.6V | 1Gb 128M x 8 | Non-Volatile | 180μs | 133MHz | FLASH | SPI |
