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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Height | Width | Operating Supply Voltage | Lead Free | Max Supply Current | Number of Terminations | Factory Lead Time | Weight | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Programming Voltage | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Parallel/Serial | Standby Current-Max | Word Size | Endurance | Access Time (Max) | Sync/Async | Data Polling | Toggle Bit | Number of Sectors/Size | Sector Size | I/O Type | Standby Voltage-Min | Memory IC Type | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 5962-8687505XA | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-59628687505xa-datasheets-3820.pdf | 61.72mm | 15.24mm | 5V | Contains Lead | 48 | 5.5V | 4.5V | 48 | 8 kb | no | 3.3mm | 2 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | No | 1 | e0 | Tin/Lead (Sn/Pb) | DUAL | 240 | 5V | 48 | MILITARY | 20 | SRAMs | 5V | 0.16mA | Qualified | 38535Q/M;38534H;883B | 3-STATE | 90 ns | 20b | 1KX8 | PARALLEL | 0.004A | 8b | Asynchronous | COMMON | 2V | MULTI-PORT SRAM | YES | ||||||||||||||||||||||||||||||||||||
| IDT71V416VS10BEI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 85°C | -40°C | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416vs10bei-datasheets-3806.pdf | TFBGA | Parallel | RAM, SRAM - Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V67903S80PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v67903s80pf-datasheets-3791.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.21mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 100MHz | 512KX18 | 18 | 9437184 bit | 0.05A | 8 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||||||
| 70V658S12BCI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.5mm | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v658s12bci-datasheets-3782.pdf | 17mm | 17mm | 3.3V | Contains Lead | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 2.3 Mb | no | 1.4mm | 2 | No | 1 | 515mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 1mm | 256 | INDUSTRIAL | SRAMs | 256kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 16b | 64KX36 | 0.015A | 36b | Asynchronous | COMMON | ||||||||||||||||||||||||||||||||||||||
| 7005L20J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Tape & Reel | 70°C | 0°C | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7005l20j8-datasheets-3777.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 64 kb | 3.63mm | 2 | No | 8kB | RAM, SDR, SRAM | 20 ns | 26b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71T75602S166PFG | Integrated Device Technology (IDT) | $14.85 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75602s166pfg-datasheets-3765.pdf | TQFP | 20mm | 14mm | 2.5V | Lead Free | 100 | 8 Weeks | 2.625V | 2.375V | 100 | Parallel | 18 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 245mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 2.3MB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.5 ns | 19b | 0.04A | 36b | Synchronous | COMMON | 2.38V | |||||||||||||||||||||||||||||||||
| MX29F040CQI-90G | Macronix |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | ASYNCHRONOUS | 3.55mm | RoHS Compliant | LCC | 14.05mm | 11.43mm | 5V | Lead Free | 32 | 32 | Parallel | 4 Mb | yes | EAR99 | 1 | e3 | Tin (Sn) | YES | QUAD | J BEND | 260 | 5V | 1.27mm | 32 | INDUSTRIAL | 40 | Flash Memories | 5V | 0.05mA | Not Qualified | FLASH, NOR | 90 ns | 5V | 512KX8 | 8 | 0.000005A | 100000 Write/Erase Cycles | YES | YES | 8 | 64K | ||||||||||||||||||||||||||||||||||||||||
| 71016S20YGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.683mm | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71016s20ygi8-datasheets-3733.pdf | 28.6mm | 10.2mm | 5V | Lead Free | 44 | 12 Weeks | 5.5V | 4.5V | 44 | Parallel | 1 Mb | yes | 2.9mm | 1 | No | 1 | 170mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 5V | 44 | INDUSTRIAL | SRAMs | 5V | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 20 ns | 16b | 16b | Asynchronous | COMMON | ||||||||||||||||||||||||||||||||||||||||
| 71T75802S133BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | -40°C | CMOS | 133MHz | 2.36mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75802s133bg-datasheets-3729.pdf | BGA | 14mm | 22mm | 2.5V | Contains Lead | 119 | 8 Weeks | 2.625V | 2.375V | 119 | Parallel | 18 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 195mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 119 | COMMERCIAL | SRAMs | 2.3MB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 20b | 0.04A | 18b | Synchronous | COMMON | 2.38V | |||||||||||||||||||||||||||||||||||
| 71V30L35TF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v30l35tf8-datasheets-3705.pdf | LQFP | 10mm | 10mm | 3.3V | Contains Lead | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 8 kb | no | 1.4mm | 2 | EAR99 | BATTERY BACKUP OPERATION | No | 1 | 115mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 64 | COMMERCIAL | 20 | SRAMs | 1kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 20b | 1KX8 | 0.003A | 8b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||||||||
| 71V67703S80PFG | Integrated Device Technology (IDT) | $6.81 |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v67703s80pfg-datasheets-3697.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 8 Weeks | 3.465V | 3.135V | 100 | Parallel | 9 Mb | yes | 1.4mm | 1 | FLOW-THROUGH ARCHITECTURE | No | 1 | 210mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 1.1MB | RAM, SDR, SRAM | 100MHz | 3-STATE | 8 ns | 18b | 256KX36 | 0.05A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||||||||||
| 7027S20PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7027s20pf8-datasheets-3688.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 512 kb | 1.4mm | 2 | No | 325mA | 64kB | RAM, SDR, SRAM | 20 ns | 30b | 16b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 7007L20PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7007l20pf-datasheets-3687.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 80 | 7 Weeks | 5.5V | 4.5V | 80 | Parallel | 256 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 275mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.65mm | 80 | COMMERCIAL | 20 | SRAMs | 5V | 32kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 15b | 0.005A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||||||||||||
| IDT71V416VL15Y8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | CMOS | 3.683mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416vl15y8-datasheets-3682.pdf | 28.575mm | 10.16mm | 44 | 44 | Parallel | 3A991.B.2.A | unknown | 8542.32.00.41 | 1 | e3 | MATTE TIN | YES | DUAL | J BEND | 3.3V | 1.27mm | 44 | COMMERCIAL | 3.6V | 3V | Not Qualified | RAM, SRAM - Asynchronous | 256KX16 | 16 | 4194304 bit | 15 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 70V08L15PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v08l15pf8-datasheets-3683.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | No | 1 | 225mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 64kB | RAM, SDR, SRAM | 3-STATE | 15 ns | 32b | 64KX8 | 0.003A | 8b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||||||||||||
| IDT71V416VS12PHGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.2mm | RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416vs12phgi-datasheets-3684.pdf | TSOP | 18.41mm | 10.16mm | 44 | Parallel | yes | 3A991.B.2.A | unknown | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) - annealed | YES | DUAL | GULL WING | 260 | 3.3V | 0.8mm | 44 | INDUSTRIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.18mA | Not Qualified | R-PDSO-G44 | RAM, SRAM - Asynchronous | 3-STATE | 256KX16 | 16 | 4194304 bit | 0.02A | 12 ns | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||
| IDT71T75602S133PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | SYNCHRONOUS | 1.6mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75602s133pfi8-datasheets-3681.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 2.5V | 0.65mm | 100 | INDUSTRIAL | 2.625V | 2.375V | 20 | SRAMs | 2.5V | 0.215mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 512KX36 | 36 | 18874368 bit | 0.06A | 4.2 ns | COMMON | 2.38V | ||||||||||||||||||||||||||||||||||||||
| 7133LA35FB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7133la35fb-datasheets-3655.pdf | 24mm | 24mm | 5V | Contains Lead | 68 | 10 Weeks | 68 | Parallel | 32 kb | no | 2mm | 2 | No | 1 | e0 | Tin/Lead (Sn/Pb) | YES | QUAD | FLAT | 240 | 5V | 68 | MILITARY | SRAMs | 5V | MIL-PRF-38535 | RAM, SRAM | 3-STATE | 22b | 0.004A | 35 ns | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||
| 71342LA55J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71342la55j-datasheets-3647.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 32 kb | no | 3.63mm | 2 | EAR99 | No | 1 | 200mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 4kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 24b | 4KX8 | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||||||||||||||||
| 71T75602S166BGGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 166MHz | 2.36mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75602s166bggi8-datasheets-3643.pdf | BGA | 14mm | 22mm | 2.5V | Lead Free | 119 | 8 Weeks | 2.625V | 2.375V | 119 | Parallel | 18 Mb | yes | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 265mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 119 | INDUSTRIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 3.5 ns | 19b | 0.06A | 36b | Synchronous | COMMON | 2.38V | |||||||||||||||||||||||||||||||||||
| IDT71V416VL15Y | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416vl15y-datasheets-3612.pdf | 28.575mm | 10.16mm | 44 | 44 | Parallel | yes | 3A991.B.2.A | unknown | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) - annealed | YES | DUAL | J BEND | 260 | 3.3V | 1.27mm | 44 | COMMERCIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.16mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 256KX16 | 16 | 4194304 bit | 0.01A | 15 ns | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||
| 71T75802S166BGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 166MHz | 2.36mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75802s166bgi-datasheets-3603.pdf | BGA | 14mm | 22mm | 2.5V | Contains Lead | 119 | 8 Weeks | 2.625V | 2.375V | 119 | Parallel | 18 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 265mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 119 | INDUSTRIAL | SRAMs | RAM, SRAM | 3-STATE | 3.5 ns | 20b | 0.045A | 18b | Synchronous | COMMON | 2.38V | |||||||||||||||||||||||||||||||||||||
| 71421SA20PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71421sa20pf-datasheets-3590.pdf | TQFP | 14mm | 1.4mm | 14mm | 5V | Contains Lead | 110mA | 64 | 7 Weeks | 360.605934mg | 5.5V | 4.5V | 64 | Parallel | 16 kb | no | 1.4mm | 2 | EAR99 | No | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 22b | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||||
| 70T659S10BC8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t659s10bc8-datasheets-3546.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 4.5 Mb | no | 1.4mm | 2 | No | 1 | 405mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 10 ns | 34b | 0.01A | 36b | Asynchronous | COMMON | ||||||||||||||||||||||||||||||||||||||
| 7005L17J | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7005l17j-datasheets-3527.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 64 kb | 3.63mm | 2 | No | 260mA | 8kB | RAM, SDR, SRAM | 17 ns | 26b | 8b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71T75602S166BGGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 166MHz | 2.36mm | RoHS Compliant | 2012 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71t75602s166bggi-datasheets-3513.pdf | BGA | 14mm | 22mm | 2.5V | Lead Free | 119 | 8 Weeks | 2.625V | 2.375V | 119 | Parallel | 18 Mb | yes | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 265mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 119 | INDUSTRIAL | 30 | SRAMs | 2.3MB | RAM, SDR, SRAM | 166MHz | 3-STATE | 3.5 ns | 19b | 0.06A | 36b | Synchronous | COMMON | 2.38V | ||||||||||||||||||||||||||||||||||
| 71321SA55JI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 1997 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71321sa55ji8-datasheets-3494.pdf | PLCC | 19mm | 19mm | 5V | Contains Lead | 52 | 7 Weeks | 5.5V | 4.5V | 52 | Parallel | 16 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | No | 1 | 190mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | INDUSTRIAL | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 22b | 0.03A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||||||||||||||
| IDT71V416VL15PHI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 85°C | -40°C | Non-RoHS Compliant | 2005 | /files/integrateddevicetechnology-idt71v416vl15phi8-datasheets-3492.pdf | TSOP | Parallel | RAM, SRAM - Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 6116SA45DB | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | 4.826mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-6116sa45db-datasheets-3487.pdf | CDIP | 32mm | 15.24mm | 5V | Contains Lead | 24 | 10 Weeks | 5.5V | 4.5V | 24 | Parallel | 16 kb | no | 2.9mm | 1 | No | 1 | e0 | Tin/Lead (Sn/Pb) | NO | DUAL | THROUGH-HOLE | 240 | 5V | 2.54mm | 24 | MILITARY | 20 | SRAMs | 5V | MIL-STD-883 Class B | 2kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 45 ns | 11b | 2KX8 | COMMON | |||||||||||||||||||||||||||||||||||||
| 70V3379S5BFI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3379s5bfi-datasheets-3453.pdf | 15mm | 15mm | 3.3V | Contains Lead | 208 | 7 Weeks | 208 | Parallel | 576 kb | no | 1.4mm | 2 | PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE | No | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 225 | 3.3V | 0.8mm | 208 | INDUSTRIAL | 3.45V | 3.15V | 20 | SRAMs | 0.415mA | RAM, SRAM | 3-STATE | 100MHz | 30b | 0.03A | 5 ns | COMMON | 3.15V |
