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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Screening Level | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 71421LA55PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71421la55pf-datasheets-7461.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 64 | 7 Weeks | 5.5V | 4.5V | 64 | Parallel | 16 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP | No | 1 | 110mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 5V | 2kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 22b | 0.0015A | 8b | Asynchronous | COMMON | 2V | |||||||||||||||||||||
| IDT71V3557S85PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3557s85pf8-datasheets-7459.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.225mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 90MHz | 128KX36 | 36 | 4718592 bit | 0.04A | 8.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||
| 7024S55JI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 85°C | -40°C | CMOS | 4.57mm | RoHS Compliant | 2000 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7024s55ji8-datasheets-7442.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 64 kb | no | 3.63mm | 2 | EAR99 | BATTERY BACKUP OPERATION | No | 1 | 300mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | INDUSTRIAL | SRAMs | 5V | 8kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 24b | 4KX16 | 0.03A | 16b | Asynchronous | COMMON | |||||||||||||||||||||||
| IDT71V3556S100PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3556s100pf8-datasheets-7437.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.25mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.04A | 5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
| 71V35761S200PFG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 200MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761s200pfg8-datasheets-7388.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 360mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 200MHz | 3-STATE | 3.1 ns | 17b | 0.03A | 36b | Synchronous | COMMON | ||||||||||||||||||||||
| 70V3379S5BF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 100MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3379s5bf-datasheets-7384.pdf | 15mm | 15mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 576 kb | no | 1.4mm | 2 | PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE | No | 1 | 360mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.8mm | 208 | COMMERCIAL | 20 | SRAMs | 72kB | RAM, SDR, SRAM | 3-STATE | 5 ns | 30b | 0.015A | 18b | Synchronous | COMMON | ||||||||||||||||||||||||
| IDT71T75702S75BGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | SYNCHRONOUS | 2.36mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75702s75bgi8-datasheets-7369.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 2.5V | 1.27mm | 119 | INDUSTRIAL | 2.625V | 2.375V | NOT SPECIFIED | SRAMs | 2.5V | 0.295mA | Not Qualified | RAM, SRAM | 3-STATE | 100MHz | 512KX36 | 36 | 18874368 bit | 0.06A | 7.5 ns | COMMON | 2.38V | ||||||||||||||||||||||||||
| IDT71V016SA15PHI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 1.2mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v016sa15phi8-datasheets-7364.pdf | TSOP | 18.41mm | 10.16mm | 44 | Parallel | no | 3A991.B.2.B | ALSO OPERATES WITH 3V TO 3.6 V SUPPLY | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | GULL WING | 225 | 3.3V | 0.8mm | 44 | INDUSTRIAL | 3.6V | 3.15V | 20 | SRAMs | 3.3V | 0.13mA | Not Qualified | R-PDSO-G44 | RAM, SRAM - Asynchronous | 3-STATE | 64KX16 | 16 | 1048576 bit | 0.01A | 15 ns | COMMON | 3.15V | ||||||||||||||||||||||||||
| IDT71V416YL10Y8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 70°C | 0°C | CMOS | 3.683mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416yl10y8-datasheets-7357.pdf | 28.575mm | 10.16mm | 44 | 44 | Parallel | no | 3A991.B.2.A | 8542.32.00.41 | 1 | e0 | TIN LEAD | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 44 | COMMERCIAL | 3.6V | 3V | 30 | Not Qualified | RAM, SRAM - Asynchronous | 256KX16 | 16 | 4194304 bit | 10 ns | |||||||||||||||||||||||||||||||||||||
| 70V24S55PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v24s55pf8-datasheets-7344.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 100 | 7 Weeks | 3.6V | 3V | 100 | Parallel | 64 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 0.18mA | 8kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 24b | 4KX16 | 0.005A | COMMON | 3V | |||||||||||||||||||||||
| IDT71V3579S75PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3579s75pf-datasheets-7331.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.465V | 3.135V | 20 | SRAMs | 3.3V | 0.255mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 117MHz | 256KX18 | 18 | 4718592 bit | 0.03A | 7.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
| 71V416S15BEI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 4 (72 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2014 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v416s15bei-datasheets-7299.pdf | TFBGA | 9mm | 9mm | 3.3V | Contains Lead | 48 | 12 Weeks | 3.6V | 3V | 48 | Parallel | 4 Mb | no | 1.2mm | 1 | No | 1 | 170mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.75mm | 48 | INDUSTRIAL | 20 | SRAMs | 512kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 15 ns | 18b | 0.02A | 16b | Asynchronous | COMMON | 3V | |||||||||||||||||||||||||
| 70T633S15BC | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t633s15bc-datasheets-7287.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 9 Mb | no | 1.4mm | 2 | No | 1 | 305mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | COMMERCIAL | 20 | SRAMs | 1.1MB | RAM, SDR, SRAM | 3-STATE | 15 ns | 38b | 0.01A | 18b | Asynchronous | COMMON | |||||||||||||||||||||||||
| IDT71T75702S75BGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | SYNCHRONOUS | 2.36mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75702s75bgi-datasheets-7257.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 2.5V | 1.27mm | 119 | INDUSTRIAL | 2.625V | 2.375V | NOT SPECIFIED | SRAMs | 2.5V | 0.295mA | Not Qualified | RAM, SRAM | 3-STATE | 100MHz | 512KX36 | 36 | 18874368 bit | 0.06A | 7.5 ns | COMMON | 2.38V | |||||||||||||||||||||||||||
| IDT71V3556S133BG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | SYNCHRONOUS | 2.36mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3556s133bg8-datasheets-7246.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 3.3V | 1.27mm | 119 | COMMERCIAL | 3.465V | 3.135V | NOT SPECIFIED | SRAMs | 3.3V | 0.3mA | Not Qualified | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.04A | 4.2 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
| 7132LA100L48B | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 1 (Unlimited) | 125°C | -55°C | CMOS | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7132la100l48b-datasheets-7234.pdf | LCC | 14.2mm | 14.22mm | 5V | Contains Lead | 48 | 10 Weeks | 5.5V | 4.5V | 48 | Parallel | 16 kb | no | 1.78mm | 2 | AUTOMATIC POWER-DOWN; BATTERY BACKUP | No | 1 | 140mA | e0 | Tin/Lead (Sn/Pb) | QUAD | 240 | 5V | 1.016mm | 48 | MILITARY | SRAMs | 5V | MIL-PRF-38535 | RAM, SRAM | 3-STATE | 100 ns | 11b | 0.004A | 8b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||||
| IDT71V416YL10Y | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.683mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416yl10y-datasheets-7226.pdf | 28.575mm | 10.16mm | 44 | 44 | Parallel | no | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 44 | COMMERCIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.18mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 256KX16 | 16 | 4194304 bit | 0.01A | 10 ns | COMMON | 3V | |||||||||||||||||||||||||||||
| 70914S20PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | 50MHz | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70914s20pf8-datasheets-7224.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 80 | Parallel | 36 kb | 1.4mm | 2 | No | 290mA | 4.5kB | RAM, SDR, SRAM | 20 ns | 24b | 9b | Synchronous | ||||||||||||||||||||||||||||||||||||||||||||
| 71V124SA10TYG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 3.7592mm | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v124sa10tyg-datasheets-7188.pdf | 21.95mm | 7.6mm | 3.3V | Lead Free | 32 | 7 Weeks | 3.6V | 3.15V | 32 | Parallel | 1 Mb | yes | 2.67mm | 1 | No | 1 | 145mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 32 | COMMERCIAL | SRAMs | 128kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 10 ns | 17b | 8b | Asynchronous | COMMON | |||||||||||||||||||||||||||||
| 7028L20PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7028l20pf-datasheets-7183.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 1 Mb | no | 1.4mm | 2 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | No | 1 | 300mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 128kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 32b | 64KX16 | 0.003A | 16b | Asynchronous | COMMON | ||||||||||||||||||||||
| 71V2556S166PFG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v2556s166pfg-datasheets-7184.pdf | TQFP | 20mm | 14mm | 3.3V | Lead Free | 100 | 12 Weeks | 3.465V | 3.135V | 100 | Parallel | 4.5 Mb | yes | 1.4mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 350mA | e3 | Matte Tin (Sn) - annealed | QUAD | FLAT | 260 | 3.3V | 0.65mm | 100 | COMMERCIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 3.5 ns | 17b | 0.04A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||
| 70T3599S133DR | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 133MHz | 4.1mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3599s133dr-datasheets-7143.pdf | PQFP | 28mm | 28mm | 2.5V | Contains Lead | 208 | 7 Weeks | 2.6V | 2.4V | 208 | Parallel | 4.5 Mb | no | 3.5mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 370mA | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 2.5V | 0.5mm | 208 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 15 ns | 34b | 0.015A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||
| AT45DB161D-TU-2.5 | Microchip |
Min: 1 Mult: 1 |
0 | 0x0x0 | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 70V3589S166DR | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 166MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3589s166dr-datasheets-7120.pdf | PQFP | 28mm | 28mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 2.3 Mb | no | 3.5mm | 2 | No | 1 | 500mA | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 208 | COMMERCIAL | SRAMs | 256kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 32b | 64KX36 | 0.03A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||
| IDT71T75702S75BG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 2.36mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75702s75bg8-datasheets-7113.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 2.5V | 1.27mm | 119 | COMMERCIAL | 2.625V | 2.375V | NOT SPECIFIED | SRAMs | 2.5V | 0.275mA | Not Qualified | RAM, SRAM | 3-STATE | 100MHz | 512KX36 | 36 | 18874368 bit | 0.04A | 7.5 ns | COMMON | 2.38V | ||||||||||||||||||||||||||
| 70V9079L9PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 70°C | 0°C | 40MHz | RoHS Compliant | 2004 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v9079l9pf8-datasheets-7115.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 7 Weeks | 3.6V | 3V | 100 | Parallel | 256 kb | 1.4mm | 2 | No | 225mA | RAM, SRAM | 20 ns | 30b | 8b | Synchronous | ||||||||||||||||||||||||||||||||||||||||||||
| 709089S12PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | 33.3MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-709089s12pf-datasheets-7110.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | No | 345mA | 100 | 64kB | RAM, SDR, SRAM | 25 ns | 32b | 8b | Synchronous | ||||||||||||||||||||||||||||||||||||||||||
| 6116SA20TPGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 1 (Unlimited) | 85°C | -40°C | CMOS | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-6116sa20tpgi-datasheets-7080.pdf | PDIP | 31.75mm | 7.62mm | 5V | Lead Free | 24 | 7 Weeks | 5.5V | 4.5V | 24 | Parallel | 16 kb | yes | 3.3mm | 1 | EAR99 | No | 1 | 105mA | e3 | MATTE TIN | DUAL | 260 | 5V | 2.54mm | 24 | INDUSTRIAL | SRAMs | 5V | 2kB | RAM, SDR, SRAM - Asynchronous | 3-STATE | 20 ns | 11b | 2KX8 | 0.002A | 8b | Asynchronous | COMMON | ||||||||||||||||||||||||
| IDT71T75702S75BG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 2.36mm | Non-RoHS Compliant | 2005 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t75702s75bg-datasheets-7045.pdf | BGA | 22mm | 14mm | 119 | Parallel | 3A991.B.2.A | FLOW-THROUGH ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | NOT SPECIFIED | 2.5V | 1.27mm | 119 | COMMERCIAL | 2.625V | 2.375V | NOT SPECIFIED | SRAMs | 2.5V | 0.275mA | Not Qualified | RAM, SRAM | 3-STATE | 100MHz | 512KX36 | 36 | 18874368 bit | 0.04A | 7.5 ns | COMMON | 2.38V | |||||||||||||||||||||||||||
| IDT71V416YL10PH8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.2mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416yl10ph8-datasheets-6952.pdf | TSOP | 18.41mm | 10.16mm | 44 | Parallel | no | 3A991.B.2.A | 8542.32.00.41 | 1 | e0 | TIN LEAD | YES | DUAL | GULL WING | 225 | 3.3V | 0.8mm | 44 | COMMERCIAL | 3.6V | 3V | 20 | Not Qualified | R-PDSO-G44 | RAM, SRAM - Asynchronous | 256KX16 | 16 | 4194304 bit | 10 ns |
