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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mount | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Factory Lead Time | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | Density | Pbfree Code | Thickness | Number of Ports | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Pin Count | Temperature Grade | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Memory Size | Memory Type | Frequency (Max) | Output Characteristics | Access Time | Clock Frequency | Address Bus Width | Organization | Memory Width | Memory Density | Standby Current-Max | Word Size | Access Time (Max) | Sync/Async | I/O Type | Standby Voltage-Min | Output Enable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 71V35761SA183BGGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 183MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761sa183bggi8-datasheets-2341.pdf | BGA | 14mm | 22mm | 3.3V | Lead Free | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | yes | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 350mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 119 | INDUSTRIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 3.3 ns | 17b | 0.035A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||
| 71V2546S100BGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 100MHz | 2.36mm | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v2546s100bgi-datasheets-2304.pdf | BGA | 14mm | 22mm | 3.3V | Contains Lead | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | no | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 260mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | OTHER | 20 | SRAMs | RAM, SRAM | 3-STATE | 5 ns | 17b | 0.045A | 36b | Synchronous | COMMON | |||||||||||||||||||||||||
| 7027S20PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7027s20pf-datasheets-2300.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 512 kb | no | 1.4mm | 2 | No | 1 | 325mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 64kB | RAM, SDR, SRAM | 3-STATE | 20 ns | 30b | 0.005A | 16b | Asynchronous | COMMON | ||||||||||||||||||||||||
| IDT71V124HSA10PH | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.2mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v124hsa10ph-datasheets-2296.pdf | SOIC | 20.95mm | 10.16mm | 32 | Parallel | 3A991.B.2.B | 8542.32.00.41 | 1 | e3 | MATTE TIN | YES | DUAL | GULL WING | 260 | 3.3V | 1.27mm | 32 | COMMERCIAL | 3.6V | 3.15V | 30 | Not Qualified | R-PDSO-G32 | RAM, SRAM - Asynchronous | 128KX8 | 8 | 1048576 bit | 10 ns | |||||||||||||||||||||||||||||||||||||
| 70P255L90BYGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p255l90bygi-datasheets-2299.pdf | TFBGA | 6mm | 6mm | Lead Free | 100 | 3V | 1.8V | 100 | Parallel | 128 kb | yes | 1mm | 2 | EAR99 | No | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 100 | INDUSTRIAL | 30 | SRAMs | 0.06mA | 16kB | RAM, SDR, SRAM | 3-STATE | 90 ns | 26b | 8KX16 | 0.000008A | COMMON | |||||||||||||||||||||||||||
| IDT71V632ZS5PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 70°C | 0°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v632zs5pf-datasheets-2291.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | 8542.32.00.41 | 1 | e0 | TIN LEAD | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | COMMERCIAL | 3.63V | 3.135V | 20 | Not Qualified | R-PQFP-G100 | RAM, SRAM | 64KX32 | 32 | 2097152 bit | ||||||||||||||||||||||||||||||||||||
| 70V06S25PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.6mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v06s25pf8-datasheets-2284.pdf | TQFP | 14mm | 14mm | 3.3V | Contains Lead | 64 | 7 Weeks | 3.6V | 3V | 64 | Parallel | 128 kb | no | 1.4mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.8mm | 64 | COMMERCIAL | 20 | SRAMs | 0.19mA | 16kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 28b | 16KX8 | 0.005A | COMMON | 2V | |||||||||||||||||||||||
| 7025L35J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 1 (Unlimited) | 70°C | 0°C | CMOS | 4.57mm | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7025l35j8-datasheets-2282.pdf | PLCC | 29.21mm | 29.21mm | 5V | Contains Lead | 84 | 7 Weeks | 5.5V | 4.5V | 84 | Parallel | 128 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP | No | 1 | 210mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 16kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 13b | 8KX16 | 0.0015A | 16b | Asynchronous | COMMON | 2V | ||||||||||||||||||||||
| 7016S35PF8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 70°C | 0°C | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7016s35pf8-datasheets-2271.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 80 | Parallel | 144 kb | 1.4mm | 2 | No | 250mA | 18kB | RAM, SDR, SRAM | 35 ns | 14b | 9b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 7143SA55G | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | Bulk | 70°C | 0°C | RoHS Compliant | 2013 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7143sa55g-datasheets-2267.pdf | 29.46mm | 29.46mm | 5V | Contains Lead | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 32 kb | 3.68mm | 2 | No | 285mA | 4kB | RAM, SDR, SRAM | 55 ns | 22b | 16b | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||
| 70V7519S133BFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v7519s133bfi8-datasheets-2219.pdf | 15mm | 15mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 9 Mb | no | 1.4mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 675mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 0.8mm | 208 | INDUSTRIAL | SRAMs | RAM, SRAM | 3-STATE | 15 ns | 18b | 0.04A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||||
| 71V35761SA183BGGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 183MHz | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761sa183bggi-datasheets-2208.pdf | BGA | 14mm | 22mm | 3.3V | Lead Free | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | yes | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 350mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 119 | INDUSTRIAL | 30 | SRAMs | 512kB | RAM, SDR, SRAM | 183MHz | 3-STATE | 3.3 ns | 17b | 0.035A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||
| 70V3589S133DRGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | 4.1mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v3589s133drgi-datasheets-2192.pdf | PQFP | 28mm | 28mm | 3.3V | Lead Free | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 2.3 Mb | yes | 3.5mm | 2 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | No | 1 | 480mA | e3 | Matte Tin (Sn) | QUAD | GULL WING | 3.3V | 0.5mm | 208 | INDUSTRIAL | SRAMs | 256kB | RAM, SDR, SRAM | 3-STATE | 25 ns | 32b | 64KX36 | 0.04A | 36b | Synchronous | COMMON | |||||||||||||||||||||||
| 70P254L55BYGI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p254l55bygi8-datasheets-2190.pdf | TFBGA | 1.8V | 81 | 16 Weeks | 1.9V | 1.7V | 81 | Parallel | 128 kb | yes | 2 | EAR99 | No | 1 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 1.8V | 81 | INDUSTRIAL | 30 | 16kB | RAM, SRAM | 55 ns | 26b | 8KX16 | 16 | |||||||||||||||||||||||||||||||||||
| IDT71V632S7PFI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2015 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v632s7pfi8-datasheets-2178.pdf | LQFP | 20mm | 14mm | 100 | Parallel | 3A991.B.2.A | PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 240 | 3.3V | 0.65mm | 100 | INDUSTRIAL | 3.63V | 3.135V | 20 | SRAMs | 3.3V | 0.16mA | Not Qualified | R-PQFP-G100 | RAM, SRAM | 3-STATE | 66MHz | 64KX32 | 32 | 2097152 bit | 0.015A | 7 ns | COMMON | 3.14V | |||||||||||||||||||||||||
| IDT6116SA25SO8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 1 (Unlimited) | 70°C | 0°C | CMOS | 2.65mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt6116sa25so8-datasheets-2177.pdf | SOIC | 15.4mm | 7.5mm | 24 | Parallel | 1 | EAR99 | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | YES | DUAL | GULL WING | 225 | 5V | 1.27mm | 24 | COMMERCIAL | 5.5V | 4.5V | 30 | SRAMs | 5V | 0.12mA | Not Qualified | R-PDSO-G24 | RAM, SRAM - Asynchronous | 3-STATE | 2KX8 | 8 | 16384 bit | 0.002A | 25 ns | COMMON | 4.5V | YES | ||||||||||||||||||||||||||
| IDT71V016SA20YI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.683mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v016sa20yi8-datasheets-2174.pdf | 28.575mm | 10.16mm | 44 | 44 | Parallel | no | 3A991.B.2.B | ALSO OPERATES WITH 3V TO 3.6 V SUPPLY | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 44 | INDUSTRIAL | 3.6V | 3.15V | 30 | SRAMs | 3.3V | 0.12mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 64KX16 | 16 | 1048576 bit | 0.01A | 20 ns | COMMON | 3.15V | |||||||||||||||||||||||||||
| 70V657S10BCG | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v657s10bcg-datasheets-2154.pdf | 17mm | 17mm | 3.3V | Lead Free | 256 | 7 Weeks | 3.45V | 3.15V | 256 | Parallel | 1.1 Mb | yes | 1.4mm | 2 | No | 1 | 500mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 1mm | 256 | COMMERCIAL | 30 | SRAMs | 128kB | RAM, SDR, SRAM | 3-STATE | 10 ns | 30b | 0.015A | 36b | Asynchronous | COMMON | ||||||||||||||||||||||||||
| 70T3509MS133BPGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | 1.7mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t3509ms133bpgi-datasheets-2144.pdf | BGA | 17mm | 17mm | 2.5V | Lead Free | 256 | 14 Weeks | 2.6V | 2.4V | 256 | Parallel | 36 Mb | yes | 1.76mm | 2 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 1.37A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 1mm | 256 | INDUSTRIAL | 30 | SRAMs | 4.5MB | RAM, SDR, SRAM | 133MHz | 3-STATE | 4.2 ns | 40b | 1MX36 | 0.08A | 36b | Synchronous | COMMON | ||||||||||||||||||||
| 71V35761SA183BGG8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 183MHz | 2.36mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-71v35761sa183bgg8-datasheets-2122.pdf | BGA | 14mm | 22mm | 3.3V | Lead Free | 119 | 7 Weeks | 3.465V | 3.135V | 119 | Parallel | 4.5 Mb | yes | 2.15mm | 1 | PIPELINED ARCHITECTURE | No | 1 | 340mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 119 | COMMERCIAL | 30 | SRAMs | RAM, SRAM | 3-STATE | 3.3 ns | 17b | 0.03A | 36b | Synchronous | COMMON | ||||||||||||||||||||||||
| 70P254L55BYGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | 85°C | -40°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70p254l55bygi-datasheets-2099.pdf | TFBGA | 5mm | 5mm | 1.8V | Lead Free | 81 | 16 Weeks | 1.9V | 1.7V | 81 | Parallel | 128 kb | yes | 1mm | 2 | EAR99 | No | 1 | e1 | TIN SILVER COPPER | YES | BOTTOM | BALL | 260 | 1.8V | 81 | INDUSTRIAL | 30 | SRAMs | 16kB | RAM, SDR, SRAM | 3-STATE | 55 ns | 26b | 8KX16 | 0.000006A | COMMON | |||||||||||||||||||||||||||
| 7006S35J8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 1 (Unlimited) | 70°C | 0°C | CMOS | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-7006s35j8-datasheets-2085.pdf | PLCC | 24mm | 24mm | 5V | Contains Lead | 68 | 7 Weeks | 5.5V | 4.5V | 68 | Parallel | 128 kb | no | 3.63mm | 2 | EAR99 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | No | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 16kB | RAM, SDR, SRAM | 3-STATE | 35 ns | 28b | 16KX8 | 0.015A | 8b | Asynchronous | COMMON | |||||||||||||||||||||||
| IDT71T016SA12BF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Surface Mount | 3 (168 Hours) | 70°C | 0°C | CMOS | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71t016sa12bf-datasheets-2086.pdf | 7mm | 2.5V | 48 | 2.7V | 2.375V | 48 | Parallel | 1 Mb | 1 | not_compliant | 1 | 150mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 0.75mm | 48 | COMMERCIAL | 20 | SRAMs | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 12 ns | 16b | 16 | 16b | Asynchronous | COMMON | 2.38V | ||||||||||||||||||||||||||||||||
| 70T653MS12BC8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel | 3 (168 Hours) | 70°C | 0°C | CMOS | 1.5mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70t653ms12bc8-datasheets-2075.pdf | 17mm | 17mm | 2.5V | Contains Lead | 256 | 7 Weeks | 2.6V | 2.4V | 256 | Parallel | 18 Mb | no | 1.4mm | 2 | No | 1 | 710mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 1mm | 256 | COMMERCIAL | 20 | SRAMs | RAM, SRAM | 3-STATE | 12 ns | 19b | 36b | Asynchronous | COMMON | |||||||||||||||||||||||||||
| IDT71V016SA20YI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.683mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v016sa20yi-datasheets-2052.pdf | 28.575mm | 10.16mm | 44 | 44 | Parallel | 3A991.B.2.B | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 44 | INDUSTRIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.12mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 64KX16 | 16 | 1048576 bit | 0.01A | 20 ns | COMMON | 3.15V | ||||||||||||||||||||||||||||||
| 70V658S12DRI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 3 (168 Hours) | 85°C | -40°C | CMOS | 4.1mm | RoHS Compliant | 2009 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-70v658s12dri-datasheets-2041.pdf | PQFP | 28mm | 28mm | 3.3V | Contains Lead | 208 | 7 Weeks | 3.45V | 3.15V | 208 | Parallel | 2.3 Mb | no | 3.5mm | 2 | No | 1 | 515mA | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 208 | INDUSTRIAL | 20 | SRAMs | 256kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 32b | 64KX36 | 0.015A | 36b | Asynchronous | COMMON | ||||||||||||||||||||||||
| IDT70V7339S133DDI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 4 (72 Hours) | 85°C | -40°C | CMOS | 133MHz | SYNCHRONOUS | 1.6mm | Non-RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt70v7339s133ddi-datasheets-2009.pdf | TQFP | 20mm | 20mm | 144 | Parallel | 2 | 3A991.B.2.A | FLOW-THROUGH OR PIPELINED ARCHITECTURE | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 144 | INDUSTRIAL | 3.45V | 3.15V | 30 | SRAMs | 2.5/3.33.3V | 0.675mA | Not Qualified | S-PQFP-G144 | RAM, SRAM | 3-STATE | 512KX18 | 18 | 9437184 bit | 0.04A | 15 ns | COMMON | 3.15V | |||||||||||||||||||||||||
| 709079L12PF | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Bulk | 3 (168 Hours) | 70°C | 0°C | CMOS | 33.3MHz | 1.6mm | RoHS Compliant | 2010 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-709079l12pf-datasheets-2003.pdf | TQFP | 14mm | 14mm | 5V | Contains Lead | 100 | 7 Weeks | 5.5V | 4.5V | 100 | Parallel | 256 kb | no | 1.4mm | 2 | EAR99 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | No | 1 | 305mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | FLAT | 240 | 5V | 0.5mm | 100 | COMMERCIAL | 20 | SRAMs | 5V | 32kB | RAM, SDR, SRAM | 3-STATE | 12 ns | 30b | 0.005A | 8b | Synchronous | COMMON | ||||||||||||||||||||
| IDT71V3556S133BQGI | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | 3 (168 Hours) | 85°C | -40°C | CMOS | 133MHz | SYNCHRONOUS | 1.2mm | RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v3556s133bqgi-datasheets-1992.pdf | 15mm | 13mm | 165 | 165 | Parallel | 3A991.B.2.A | unknown | 8542.32.00.41 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 3.3V | 1mm | 165 | INDUSTRIAL | 3.465V | 3.135V | 30 | SRAMs | 3.3V | 0.31mA | Not Qualified | RAM, SRAM | 3-STATE | 128KX36 | 36 | 4718592 bit | 0.045A | 4.2 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||
| IDT71V416S12YI8 | Integrated Device Technology (IDT) |
Min: 1 Mult: 1 |
0 | 0x0x0 | Tape & Reel (TR) | 3 (168 Hours) | 85°C | -40°C | CMOS | 3.683mm | Non-RoHS Compliant | 2007 | https://pdf.utmel.com/r/datasheets/integrateddevicetechnology-idt71v416s12yi8-datasheets-1979.pdf | 28.575mm | 10.16mm | 44 | 44 | Parallel | no | 3A991.B.2.A | not_compliant | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | YES | DUAL | J BEND | 225 | 3.3V | 1.27mm | 44 | INDUSTRIAL | 3.6V | 3V | 30 | SRAMs | 3.3V | 0.18mA | Not Qualified | RAM, SRAM - Asynchronous | 3-STATE | 256KX16 | 16 | 4194304 bit | 0.02A | 12 ns | COMMON | 3V |
