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ContactTransistor Sockets(21155)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Type | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | RoHS Status | Published | Datasheet | Current Rating | Factory Lead Time | Number of Pins | Pbfree Code | Number of Positions | Number of Contacts | Contact Finish - Mating | Flammability Rating | ECCN Code | Additional Feature | Contact Plating | Housing Material | Lead Length | Insulation Resistance | Contact Resistance | Feature | Terminal Pitch | Body Length or Diameter | Body Breadth | Current Rating (Amps) | PCB Contact Pattern | Body Depth | Contact Style | Mating Contact Pitch | Dielectric Withstanding Voltage | Number of Positions or Pins (Grid) | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Material - Post | Pitch - Mating | Termination Post Length | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 44-3553-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 55 | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 6 Weeks | 44 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyetheretherketone (PEEK), Glass Filled | 1000000000Ohm | Closed Frame | 2.54mm | 2.79 inch | 0.9 inch | 1A | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 44 (2 x 22) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||
| 48-6575-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | /files/arieselectronics-24657410-datasheets-8308.pdf | 1A | 6 Weeks | 48 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 1A | 48 (2 x 24) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Gold | 10.0μin 0.25μm | |||||||||||||||||||
| 558-10-504M29-001101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 558 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55810272m20001101-datasheets-4926.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 504 (29 x 29) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.050 1.27mm | 0.111 2.83mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||||||
| 558-10-652M35-001101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 558 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55810272m20001101-datasheets-4926.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 652 (35 x 35) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.050 1.27mm | 0.111 2.83mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||||||
| 518-77-600M35-001105 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 518 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51877256m20001105-datasheets-4892.pdf | 1A | 10 Weeks | 600 | Gold | UL94 V-0 | FR4 Epoxy Glass | 2.794mm | 10mOhm | Open Frame | 600 (35 x 35) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.050 1.27mm | 0.110 2.78mm | 0.050 1.27mm | |||||||||||||||||||||
| 558-10-520M31-001101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 558 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55810272m20001101-datasheets-4926.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 520 (31 x 31) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.050 1.27mm | 0.111 2.83mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||||||
| 48-6574-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 6 Weeks | 48 | Gold | UL94 V-0 | Gold | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 1A | 48 (2 x 24) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Gold | 10.0μin 0.25μm | |||||||||||||||||||
| 558-10-456M26-001104 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 558 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55810256m20001104-datasheets-4888.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 456 (26 x 26) | UL94 V-0 | 10.0μin 0.25μm | Brass | 0.050 1.27mm | 0.086 2.20mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||||||
| 518-77-478M26-131106 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 518 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51877256m20001106-datasheets-4965.pdf | 1A | 10 Weeks | 478 | Gold | UL94 V-0 | FR4 Epoxy Glass | 1.5748mm | 10mOhm | Open Frame | 478 (26 x 26) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.050 1.27mm | 0.062 1.57mm | 0.050 1.27mm | |||||||||||||||||||||
| 44-3575-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 6 Weeks | yes | 44 | 44 | Tin | UL94 V-0 | EAR99 | UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 44 (2 x 22) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||
| 550-10-500M30-001152 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 550 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55010192m16001152-datasheets-4176.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 500 (30 x 30) | UL94 V-0 | 10.0μin 0.25μm | Brass | 0.050 1.27mm | 0.086 2.20mm | 0.050 1.27mm | 10.0μin 0.25μm | |||||||||||||||||||||||||
| 514-83-600M35-001148 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 514 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/precidip-51487192m16001148-datasheets-7359.pdf | 1A | 10 Weeks | 600 | Gold | UL94 V-0 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 1.397mm | 10mOhm | Open Frame | 600 (35 x 35) | UL94 V-0 | 29.5μin 0.75μm | Beryllium Copper | Brass | 0.100 2.54mm | 0.055 1.40mm | 0.100 2.54mm | Tin | ||||||||||||||||||||
| 518-77-520M31-001105 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 518 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/precidip-51877256m20001105-datasheets-4892.pdf | 1A | 10 Weeks | 520 | Gold | UL94 V-0 | FR4 Epoxy Glass | 2.794mm | 10mOhm | Open Frame | 520 (31 x 31) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.050 1.27mm | 0.110 2.78mm | 0.050 1.27mm | |||||||||||||||||||||
| 518-77-500M30-001106 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 518 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51877256m20001106-datasheets-4965.pdf | 1A | 10 Weeks | 500 | Gold | UL94 V-0 | FR4 Epoxy Glass | 1.5748mm | 10mOhm | Open Frame | 500 (30 x 30) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.050 1.27mm | 0.062 1.57mm | 0.050 1.27mm | |||||||||||||||||||||
| 48-3574-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-24657410-datasheets-8308.pdf | 1A | 6 Weeks | yes | 48 | 48 | Tin | UL94 V-0 | EAR99 | UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 48 (2 x 24) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||
| 518-77-520M31-001106 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 518 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51877256m20001106-datasheets-4965.pdf | 1A | 10 Weeks | 520 | Gold | UL94 V-0 | FR4 Epoxy Glass | 1.5748mm | 10mOhm | Open Frame | 520 (31 x 31) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.050 1.27mm | 0.062 1.57mm | 0.050 1.27mm | |||||||||||||||||||||
| 558-10-576M30-001101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 558 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55810272m20001101-datasheets-4926.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 576 (30 x 30) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.050 1.27mm | 0.111 2.83mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||||||
| 2676-9318-00-2401 | 3M |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 1 (Unlimited) | RoHS Compliant | 8 Weeks | |||||||||||||||||||||||||||||||||||||||||||||
| 48-3552-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 55 | Through Hole | -55°C~250°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 6 Weeks | 48 | Nickel Boron | EAR99 | STANDARD: UL 94V-0 | Polyetheretherketone (PEEK), Glass Filled | 1000000000Ohm | Closed Frame | 2.54mm | 2.99 inch | 0.9 inch | 1A | RECTANGULAR | 0.47 inch | SQ PIN-SKT | 0.1 inch | 1000VAC V | 48 (2 x 24) | UL94 V-0 | 50.0μin 1.27μm | Beryllium Nickel | Beryllium Nickel | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | Nickel Boron | 50.0μin 1.27μm | ||||||||||||||
| 558-10-478M26-131101 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 558 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55810272m20001101-datasheets-4926.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Open Frame | 1A | 478 (26 x 26) | UL94 V-0 | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.050 1.27mm | 0.111 2.83mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||||||
| 518-77-480M29-001105 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 518 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51877256m20001105-datasheets-4892.pdf | 1A | 10 Weeks | 480 | Gold | UL94 V-0 | FR4 Epoxy Glass | 2.794mm | 10mOhm | Open Frame | 480 (29 x 29) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.050 1.27mm | 0.110 2.78mm | 0.050 1.27mm | |||||||||||||||||||||
| 518-77-500M30-001105 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 518 | Through Hole | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51877256m20001105-datasheets-4892.pdf | 1A | 10 Weeks | 500 | Gold | UL94 V-0 | FR4 Epoxy Glass | 2.794mm | 10mOhm | Open Frame | 500 (30 x 30) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.050 1.27mm | 0.110 2.78mm | 0.050 1.27mm | |||||||||||||||||||||
| 558-10-480M29-001104 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 558 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | /files/precidip-55810256m20001104-datasheets-4888.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 480 (29 x 29) | UL94 V-0 | 10.0μin 0.25μm | Brass | 0.050 1.27mm | 0.086 2.20mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||||||
| 550-10-560M33-001152 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 550 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55010192m16001152-datasheets-4176.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 560 (33 x 33) | UL94 V-0 | 10.0μin 0.25μm | Brass | 0.050 1.27mm | 0.086 2.20mm | 0.050 1.27mm | 10.0μin 0.25μm | |||||||||||||||||||||||||
| 558-10-388M26-001104 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 558 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55810256m20001104-datasheets-4888.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 388 (26 x 26) | UL94 V-0 | 10.0μin 0.25μm | Brass | 0.050 1.27mm | 0.086 2.20mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||||||
| 550-10-520M31-001152 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 550 | Through Hole | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55010192m16001152-datasheets-4176.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 520 (31 x 31) | UL94 V-0 | 10.0μin 0.25μm | Brass | 0.050 1.27mm | 0.086 2.20mm | 0.050 1.27mm | 10.0μin 0.25μm | |||||||||||||||||||||||||
| 518-77-480M29-001106 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 518 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51877256m20001106-datasheets-4965.pdf | 1A | 10 Weeks | 480 | Gold | UL94 V-0 | FR4 Epoxy Glass | 1.5748mm | 10mOhm | Open Frame | 480 (29 x 29) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.050 1.27mm | 0.062 1.57mm | 0.050 1.27mm | |||||||||||||||||||||
| 42-3575-18 | Aries Electronics |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 57 | Through Hole | Through Hole | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/arieselectronics-40655411-datasheets-2991.pdf | 1A | 6 Weeks | yes | 42 | 42 | Tin | UL94 V-0 | EAR99 | UL 94V-0 | Polyphenylene Sulfide (PPS), Glass Filled | 2.794mm | Closed Frame | 42 (2 x 21) | UL94 V-0 | 200.0μin 5.08μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | 0.110 2.78mm | 0.100 2.54mm | 200.0μin 5.08μm | ||||||||||||||||||
| 558-10-500M30-001104 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | BGA | 558 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-55810256m20001104-datasheets-4888.pdf | 10 Weeks | Gold | FR4 Epoxy Glass | 10mOhm | Closed Frame | 1A | 500 (30 x 30) | UL94 V-0 | 10.0μin 0.25μm | Brass | 0.050 1.27mm | 0.086 2.20mm | 0.050 1.27mm | 10.0μin 0.25μm | ||||||||||||||||||||||||
| 518-77-504M29-001106 | Preci-Dip |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | PGA | 518 | Surface Mount | Surface Mount | -55°C~125°C | Bulk | 1 (Unlimited) | Solder | ROHS3 Compliant | 2012 | https://pdf.utmel.com/r/datasheets/precidip-51877256m20001106-datasheets-4965.pdf | 1A | 10 Weeks | 504 | Gold | UL94 V-0 | FR4 Epoxy Glass | 1.5748mm | 10mOhm | Open Frame | 504 (29 x 29) | UL94 V-0 | Flash | Beryllium Copper | Brass | 0.050 1.27mm | 0.062 1.57mm | 0.050 1.27mm |
