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ContactHeaders & Male Pins(495564)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Termination | RoHS Status | Published | Datasheet | Lead Free | Factory Lead Time | Lead Pitch | Pbfree Code | Connector Type | Number of Positions | Gender | MIL Conformance | DIN Conformance | IEC Conformance | Filter Feature | Mixed Contacts | Option | Mating Information | Contact Finish - Mating | ECCN Code | Contact Material | Total Number of Contacts | Radiation Hardening | HTS Code | JESD-609 Code | Terminal Pitch | Insulation Material | Number of Rows | Style | Current Rating (Amps) | UL Flammability Code | Shrouding | Fastening Type | Material Flammability Rating | Contact Shape | Insulation Color | Contact Type | Number of Positions Loaded | Contact Finish Thickness - Mating | Pitch - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Insulation Height | Contact Length - Post | Contact Length - Mating | Overall Contact Length | Row Spacing - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| HMTSW-110-09-G-D-390-RA | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole, Right Angle | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | Header | 20 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | EAR99 | Phosphor Bronze | 20 | 8536.69.40.40 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | 94V-0 | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | 3.00μin 0.076μm | 0.240 6.10mm | 0.390 9.91mm | 0.100 (2.54mm) | |||||||||||||
| HMTSW-114-22-L-D-225 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 2016 | Lead Free | 3 Weeks | 2.54mm | yes | Header | 28 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.305 7.75mm | 0.225 5.72mm | 0.630 16.00mm | 0.100 (2.54mm) | ||||||||||||
| HMTSW-114-22-L-D-100 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | yes | Header | 28 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.430 10.92mm | 0.100 2.54mm | 0.630 16.00mm | 0.100 (2.54mm) | |||||||||||||
| HMTSW-116-10-T-Q-225 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~105°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 2016 | Lead Free | 3 Weeks | 2.54mm | yes | Header | 32 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Tin | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 0.100 2.54mm | 0.100 2.54mm | 0.505 12.83mm | 0.225 5.72mm | 0.830 21.08mm | 0.200 (5.08mm) | ||||||||||||||
| HMTSW-118-07-F-D-150 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/samtec-hmtsw11807fd150-datasheets-3248.pdf | Lead Free | 3 Weeks | 2.54mm | Header | 36 | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | 94V-0 | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 3.00μin 0.076μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.180 4.57mm | 0.150 3.81mm | 0.430 10.92mm | 0.100 (2.54mm) | |||||||||||||||
| HMTSW-110-11-G-D-225 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/samtec-hmtsw11011gd225-datasheets-3250.pdf | Lead Free | 3 Weeks | 2.54mm | yes | Header | 20 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | MULTIPLE MATING PARTS AVAILABLE | Gold | Phosphor Bronze | e4 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | 3.00μin 0.076μm | 0.100 2.54mm | 0.605 15.37mm | 0.225 5.72mm | 0.930 23.62mm | 0.100 (2.54mm) | |||||||||||
| HMTSW-125-10-L-S-610 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | Header | 25 | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | 1 | Board to Board or Cable | 3A | 94V-0 | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.120 3.05mm | 0.610 15.49mm | 0.830 21.08mm | |||||||||||||||||
| HMTSW-130-08-L-S-290 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 2016 | Lead Free | 3 Weeks | 2.54mm | Header | 30 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | No | e3 | Liquid Crystal Polymer (LCP) | 1 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.140 3.56mm | 0.290 7.37mm | 0.530 13.46mm | |||||||||||||
| HMTSW-207-22-L-D-440 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 2016 | Lead Free | 3 Weeks | 5.08mm | yes | Header | 14 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | EAR99 | Phosphor Bronze | 8536.69.40.40 | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.200 5.08mm | Tin | 0.100 2.54mm | 0.090 2.29mm | 0.440 11.17mm | 0.630 16.00mm | 0.100 (2.54mm) | ||||||||||
| HMTSW-120-09-G-S-430-RA | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole, Right Angle | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | Header | 20 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | 20 | e4 | Liquid Crystal Polymer (LCP) | 1 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | 3.00μin 0.076μm | 0.119 3.02mm | 0.430 10.92mm | ||||||||||||||||
| HMTSW-114-28-T-Q-730 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~105°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 2016 | Lead Free | 3 Weeks | 2.54mm | yes | Header | 28 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Tin | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 0.100 2.54mm | 0.100 2.54mm | 0.300 7.62mm | 0.730 18.54mm | 1.130 28.70mm | 0.200 (5.08mm) | ||||||||||||||
| HMTSW-110-11-G-D-430 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | yes | Header | 20 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | MULTIPLE MATING PARTS AVAILABLE | Gold | Phosphor Bronze | e4 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | 3.00μin 0.076μm | 0.100 2.54mm | 0.400 10.16mm | 0.430 10.92mm | 0.930 23.62mm | 0.100 (2.54mm) | ||||||||||||
| HMTSW-111-09-G-D-200 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/samtec-hmtsw11109gd200-datasheets-3213.pdf | Lead Free | 3 Weeks | 2.54mm | yes | Header | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | MULTIPLE MATING PARTS AVAILABLE | Gold | Phosphor Bronze | e4 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | 3.00μin 0.076μm | 0.100 2.54mm | 0.430 10.92mm | 0.200 5.08mm | 0.730 18.54mm | 0.100 (2.54mm) | |||||||||||
| HMTSW-114-28-T-Q-990 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~105°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | yes | Header | 28 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Tin | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 0.100 2.54mm | 0.100 2.54mm | 0.040 1.02mm | 0.990 25.15mm | 1.130 28.70mm | 0.200 (5.08mm) | |||||||||||||||
| HMTSW-114-28-T-Q-100 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~105°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | yes | Header | 28 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Tin | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 0.100 2.54mm | 0.100 2.54mm | 0.930 23.62mm | 0.100 2.54mm | 1.130 28.70mm | 0.200 (5.08mm) | |||||||||||||||
| HMTSW-111-28-L-D-990 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/samtec-hmtsw11128ld990-datasheets-3219.pdf | Lead Free | 3 Weeks | 2.54mm | yes | Header | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.040 1.02mm | 0.990 25.15mm | 1.130 28.70mm | 0.100 (2.54mm) | ||||||||||||
| HMTSW-116-10-T-Q-100 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~105°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 2016 | https://pdf.utmel.com/r/datasheets/samtec-hmtsw11610tq100-datasheets-3221.pdf | Lead Free | 3 Weeks | 2.54mm | yes | Header | 32 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Tin | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 0.100 2.54mm | 0.100 2.54mm | 0.630 16.00mm | 0.100 2.54mm | 0.830 21.08mm | 0.200 (5.08mm) | |||||||||||||
| HMTSW-111-28-L-D-430 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 2016 | Lead Free | 3 Weeks | 2.54mm | yes | Header | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.600 15.24mm | 0.430 10.92mm | 1.130 28.70mm | 0.100 (2.54mm) | ||||||||||||
| HMTSW-112-11-L-D-740 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | yes | Header | 24 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.090 2.29mm | 0.740 18.80mm | 0.930 23.62mm | 0.100 (2.54mm) | |||||||||||||
| HMTSW-116-10-T-Q-200 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~105°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/samtec-hmtsw11610tq200-datasheets-3227.pdf | Lead Free | 3 Weeks | 2.54mm | yes | Header | 32 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Tin | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 0.100 2.54mm | 0.100 2.54mm | 0.530 13.46mm | 0.200 5.08mm | 0.830 21.08mm | 0.200 (5.08mm) | ||||||||||||||
| HMTSW-114-28-T-Q-740 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~105°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | yes | Header | 28 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Tin | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 0.100 2.54mm | 0.100 2.54mm | 0.290 7.37mm | 0.740 18.80mm | 1.130 28.70mm | 0.200 (5.08mm) | |||||||||||||||
| HMTSW-113-12-S-S-677-NA | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 3 Weeks | Header | 13 | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | 2.54mm | Liquid Crystal Polymer (LCP) | 1 | Board to Board or Cable | 3A | 94V-0 | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 30.0μin 0.76μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.253 6.43mm | 0.677 17.20mm | 1.030 26.16mm | ||||||||||||||||||
| HMTSW-115-08-L-D-340 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | yes | Header | 30 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.090 2.29mm | 0.340 8.64mm | 0.530 13.46mm | 0.100 (2.54mm) | |||||||||||||
| HMTSW-114-22-L-D-430 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | yes | Header | 28 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.100 2.54mm | 0.430 10.92mm | 0.630 16.00mm | 0.100 (2.54mm) | |||||||||||||
| HMTSW-115-13-T-D-1040-LL | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~105°C | Bulk | Not Applicable | Kinked Pin, Solder | ROHS3 Compliant | 3 Weeks | yes | Header | 30 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Tin | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 0.100 2.54mm | 0.100 2.54mm | 0.090 2.29mm | 1.040 26.42mm | 1.230 31.24mm | 0.100 (2.54mm) | |||||||||||||||||
| HMTSW-111-09-G-D-540 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | yes | Header | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | MULTIPLE MATING PARTS AVAILABLE | Gold | Phosphor Bronze | e4 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | 3.00μin 0.076μm | 0.100 2.54mm | 0.090 2.29mm | 0.540 13.72mm | 0.730 18.54mm | 0.100 (2.54mm) | ||||||||||||
| HMTSW-111-28-L-D-200 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | 2016 | Lead Free | 3 Weeks | 2.54mm | yes | Header | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.830 21.08mm | 0.200 5.08mm | 1.130 28.70mm | 0.100 (2.54mm) | ||||||||||||
| HMTSW-111-09-G-D-100 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | yes | Header | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | MULTIPLE MATING PARTS AVAILABLE | Gold | Phosphor Bronze | e4 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | 3.00μin 0.076μm | 0.100 2.54mm | 0.530 13.46mm | 0.100 2.54mm | 0.730 18.54mm | 0.100 (2.54mm) | ||||||||||||
| HMTSW-111-28-L-D-225 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | Lead Free | 3 Weeks | 2.54mm | yes | Header | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | Gold | Phosphor Bronze | e3 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | Tin | 0.100 2.54mm | 0.805 20.45mm | 0.225 5.72mm | 1.130 28.70mm | 0.100 (2.54mm) | |||||||||||||
| HMTSW-111-09-G-D-225 | Samtec Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Flex Stack, HMTSW | Through Hole | Through Hole | -55°C~125°C | Bulk | Not Applicable | Solder | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/samtec-hmtsw11109gd225-datasheets-3191.pdf | Lead Free | 3 Weeks | 2.54mm | yes | Header | 22 | Male | NO | NO | NO | NO | NO | GENERAL PURPOSE | MULTIPLE MATING PARTS AVAILABLE | Gold | Phosphor Bronze | e4 | Liquid Crystal Polymer (LCP) | 2 | Board to Board or Cable | 3A | Unshrouded | Push-Pull | UL94 V-0 | Square | Natural | Male Pin | All | 10.0μin 0.25μm | 0.100 2.54mm | 3.00μin 0.076μm | 0.100 2.54mm | 0.405 10.29mm | 0.225 5.72mm | 0.730 18.54mm | 0.100 (2.54mm) |
